Assignee
PANG MENGZHI
US·3 granted patents·8 pending applications·6 citations·filing 2005–2012
Top patents by PatentIndex Score
11 records- 0172US8508054B2Enhanced bump pitch scalingPANG MENGZHI·Filed 2011·Granted Aug 13, 2013·4 cites·22 claims
- 0261US8395051B2Doping of lead-free solder alloys and structures formed therebyPANG MENGZHI·Filed 2008·Granted Mar 12, 2013·2 cites·6 claims
- 0348US2008242063A1Solder composition doped with a barrier component and method of making samePANG MENGZHI·Filed 2007·Application pending·0 cites
- 0446US2007145104A1System and method for advanced solder bumping using a disposable maskPANG MENGZHI·Filed 2005·Application pending·0 cites
- 0545US8759974B2Solder joints with enhanced electromigration resistancePANG MENGZHI·Filed 2011·Granted Jun 24, 2014·0 cites·13 claims
- 0643US2007148951A1System and method for flip chip substrate padPANG MENGZHI·Filed 2005·Application pending·0 cites
- 0743US2007155154A1System and method for solder bumping using a disposable mask and a barrier layerPANG MENGZHI·Filed 2005·Application pending·0 cites
- 0843US2009166864A1Method to prevent copper migration in a semiconductor packagePANG MENGZHI·Filed 2007·Application pending·0 cites
- 0941US2008160751A1Microelectronic die including solder caps on bumping sites thereof and method of making samePANG MENGZHI·Filed 2006·Application pending·0 cites
- 1039US2013187284A1Low Cost and High Performance Flip Chip PackagePANG MENGZHI·Filed 2012·Application pending·0 cites
- 1137US2013075907A1Interconnection Between Integrated Circuit and PackagePANG MENGZHI·Filed 2011·Application pending·0 cites
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