Inventor · disambiguated record
Younsang Kim
Also filed as: KIM YOUNSANG
8 granted patents·5 pending applications·53 citations·filing 2006–2018
82Inventor score
Files withHenkel IP & Holding GmbH6AMKOR TECHNOLOGY INC2DUTT GYANENDRA1Henkel US IP LLC1KIM YOUNSANG1
Top patents by PatentIndex Score
13 records- 0192US7675180B1Stacked electronic component package having film-on-wire spacerAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 9, 2010·38 cites·19 claims
- 0285US8072083B1Stacked electronic component package having film-on-wire spacerST AMAND ROGER D·Filed 2010·Granted Dec 6, 2011·10 cites·17 claims
- 0364US10242923B2Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packagesHenkel IP & Holding GmbH·Filed 2018·Granted Mar 26, 2019·1 cites·21 claims
- 0462US9082840B2Coating adhesives onto dicing before grinding and micro-fabricated wafersHenkel IP & Holding GmbH·Filed 2014·Granted Jul 14, 2015·1 cites·3 claims
- 0562US8753959B2Coating adhesives onto dicing before grinding and micro-fabricated wafersYUN HWANG KYU·Filed 2012·Granted Jun 17, 2014·2 cites·5 claims
- 0657US10913879B2Thermally conductive pre-applied underfill formulations and uses thereofHenkel IP & Holding GmbH·Filed 2016·Granted Feb 9, 2021·1 cites·20 claims
- 0739US9362105B2Pre-cut wafer applied underfill film on dicing tapeHenkel IP & Holding GmbH·Filed 2013·Granted Jun 7, 2016·0 cites·12 claims
- 0839US2014290843A1Method of preparing an adhesive film into a precut semiconductor wafer shape on a dicing tapeHenkel IP & Holding GmbH·Filed 2014·Application pending·0 cites
- 0938US9281182B2Pre-cut wafer applied underfill filmHenkel IP & Holding GmbH·Filed 2013·Granted Mar 8, 2016·0 cites·12 claims
- 1037US2012175746A1Selective Deposition in the Fabrication of Electronic SubstratesKIM YOUNSANG·Filed 2012·Application pending·0 cites
- 1137US2008237824A1Stacked electronic component package having single-sided film spacerAMKOR TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 1235US2014057411A1Dicing before grinding after coatingHenkel US IP LLC·Filed 2013·Application pending·0 cites
- 1332US2013136858A1Adhesive recycling during spin coatingDUTT GYANENDRA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →