Selective Deposition in the Fabrication of Electronic Substrates

Abstract

A semiconductor substrate is coated with a single layer of different materials selected from adhesives, coatings, and encapsulants.

1 . A semiconductor substrate coated with a single layer of different materials selected from adhesives, coatings, and encapsulants. 
     
     
         2 . The semiconductor substrate according to  claim 1  in which the substrate comprises stacked semiconductor wafers with dicing lines, the wafers adhered together with a single layer of adhesive, in which the adhesive along the dicing lines is a high modulus adhesive, and the adhesive off the dicing lines is a low modulus adhesive. 
     
     
         3 . The semiconductor substrate according to  claim 1  in which the substrate comprises a semiconductor wafer with via openings and a die pattern formed with dicing lines, the semiconductor wafer coated with a high modulus adhesive along the dicing lines, a conductive material at the via openings, and a low modulus adhesive in the center of the die pattern formed by the dicing lines. 
     
     
         4 . The semiconductor substrate according to  claim 1  in which the substrate comprises a stack of semiconductor dies having wire bonds, in which a high flow, high modulus adhesive is applied to the wire bonds, and a low flow, low modulus adhesive is applied to the remainder of the semiconductor dies. 
     
     
         5 . The semiconductor substrate according to  claim 1  in which the substrate comprises an image sensor coated with a transparent filler material and wire bonds covered with a high flow adhesive. 
     
     
         6 . The semiconductor substrate according to  claim 1  in which the substrate comprises a flip-chip device containing solder ball pads in which a fluxing agent is coated onto the solder ball pads and an underfill encapsulant is coated on the area surrounding the solder ball pads.