Inventor · disambiguated record
Michishige Saito
Also filed as: SAITO MICHISHIGE
18 granted patents·15 pending applications·64 citations·filing 2001–2025
91Inventor score
Top patents by PatentIndex Score
33 records- 0193US11742183B2Plasma processing apparatus and control methodTOKYO ELECTRON LTD·Filed 2021·Granted Aug 29, 2023·3 cites·16 claims
- 0288US11201034B2Plasma processing apparatus and control methodTOKYO ELECTRON LTD·Filed 2019·Granted Dec 14, 2021·5 cites·20 claims
- 0388US7506610B2Plasma processing apparatus and methodTOKYO ELECTRON LTD·Filed 2005·Granted Mar 24, 2009·15 cites·16 claims
- 0486US7494561B2Plasma processing apparatus and method, and electrode plate for plasma processing apparatusTOKYO ELECTRON LTD·Filed 2005·Granted Feb 24, 2009·12 cites·32 claims
- 0582US8821742B2Plasma etching methodYOSHIDA RYOICHI·Filed 2010·Granted Sep 2, 2014·8 cites·11 claims
- 0680US2023061699A1Upper electrode and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 0778US11532461B2Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Dec 20, 2022·2 cites·17 claims
- 0877US8512510B2Plasma processing method and apparatusKOSHIISHI AKIRA·Filed 2011·Granted Aug 20, 2013·3 cites·17 claims
- 0976US9613837B2Substrate processing apparatus and maintenance method thereofTOKYO ELECTRON LTD·Filed 2013·Granted Apr 4, 2017·4 cites·17 claims
- 1074US2024207882A1Film forming apparatus and method for manufacturing part having film containing siliconTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1173US2024254620A1Restoring method of consumed componentTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1273US2024234099A1Forming method of component and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1372US2025226190A1Stage and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1470US11919032B2Film forming apparatus and method for manufacturing part having film containing siliconTOKYO ELECTRON LTD·Filed 2021·Granted Mar 5, 2024·0 cites·25 claims
- 1568US12288676B2Stage and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Apr 29, 2025·0 cites·8 claims
- 1665US6620245B2Liquid coating apparatus with temperature controlling manifoldTOKYO ELECTRON LTD·Filed 2001·Granted Sep 16, 2003·12 cites·14 claims
- 1764US11515125B2Upper electrode and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Nov 29, 2022·0 cites·8 claims
- 1859US11967487B2Forming method of component and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Apr 23, 2024·0 cites·10 claims
- 1958US11981993B2Forming method of component and substrate processing systemTOKYO ELECTRON LTD·Filed 2019·Granted May 14, 2024·0 cites·6 claims
- 2058US11443922B2High frequency power supply member and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Sep 13, 2022·0 cites·10 claims
- 2157US2010043974A1Plasma processing method and apparatusKOSHIISHI AKIRA·Filed 2009·Application pending·0 cites
- 2256US12494349B2Member, manufacturing method of member and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Dec 9, 2025·0 cites·10 claims
- 2356US2025226185A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2456US2015179405A1Upper electrode and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 2554US12300475B2Substrate support and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted May 13, 2025·0 cites·13 claims
- 2652US11764040B2Placing table and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Sep 19, 2023·0 cites·11 claims
- 2750US2025178234A1Method of additively manufacturing high-purity silicon, method of additively manufacturing semiconductor manufacturing equipment component, semiconductor manufacturing equipment component, and method of forming semiconductor manufacturing equipment componentTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2849US2006000803A1Plasma processing method and apparatusKOSHIISHI AKIRA·Filed 2005·Application pending·0 cites
- 2947US2021178523A1Part for substrate processing apparatus and substrate processing systemTOKYO ELECTRON LTD·Filed 2020·Application pending·0 cites
- 3047US2015129112A1Shower head assembly, plasma processing apparatus and method for manufacturing a shower head assemblyTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 3145US2020312623A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2020·Application pending·0 cites
- 3244US2006042754A1Plasma etching apparatusTOKYO ELECTRON LTD·Filed 2005·Application pending·0 cites
- 3330US2017069470A1Upper electrode structure of plasma processing apparatus, plasma processing apparatus, and operation method thereforTOKYO ELECTRON LTD·Filed 2015·Application pending·0 cites
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