Inventor · disambiguated record
Jun Yang
Also filed as: YANG JUN · Yang jun-min
20 granted patents·6 pending applications·13 citations·filing 2010–2023
89Inventor score
Files withEXSENSE ELECTRONICS TECH CO LTD3JINKO GREEN ENERGY SHANGHAI MAN CO LTD3WISTRON CORP3YANTAI SHUANGTA FOOD CO LTD3JINKO SOLAR CO LTD2
Top patents by PatentIndex Score
26 records- 0178US8614120B2Semiconductor chip package and method of making sameYANG JUN·Filed 2011·Granted Dec 24, 2013·5 cites·20 claims
- 0274US12294036B2Method for manufacturing monocrystalline silicon wafer containing arced side, method for manufacturing monocrystalline silicon cell, and photovoltaic moduleJINKO SOLAR CO LTD·Filed 2023·Granted May 6, 2025·0 cites·19 claims
- 0368US2023250549A1Method for preparing monocrystalline silicon and solar cell and photovoltaic module with monocrystalline siliconJINKO GREEN ENERGY SHANGHAI MAN CO LTD·Filed 2023·Application pending·0 cites
- 0464US8378370B2LED package structureAMBIT MICROSYSTEMS ZHONGSHAN LTD·Filed 2011·Granted Feb 19, 2013·2 cites·12 claims
- 0561US11742453B2Method for manufacturing monocrystalline silicon wafer containing arced side, method for manufacturing monocrystalline silicon cell, and photovoltaic moduleJINKO SOLAR CO LTD·Filed 2020·Granted Aug 29, 2023·0 cites·18 claims
- 0661US10636550B2Composite thermistor chip and preparation method thereofEXSENSE ELECTRONICS TECH CO LTD·Filed 2018·Granted Apr 28, 2020·1 cites·7 claims
- 0758US10565427B2Fingerprint sensor package and fabricating method thereofSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2018·Granted Feb 18, 2020·0 cites·10 claims
- 0857US2021404085A1Method for preparing monocrystalline silicon and solar cell and photovoltaic module with monocrystalline siliconJINKO GREEN ENERGY SHANGHAI MAN CO LTD·Filed 2020·Application pending·0 cites
- 0956US9953206B2Fingerprint sensor package and fabricating method thereofSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2016·Granted Apr 24, 2018·0 cites·9 claims
- 1054US11861935B2Fingerprint detection method and fingerprint moduleSILEAD INC·Filed 2022·Granted Jan 2, 2024·0 cites·17 claims
- 1152US8656583B2Method for assembling components on a circuit boardWISTRON CORP·Filed 2013·Granted Feb 25, 2014·0 cites·11 claims
- 1251US11739436B2Apparatus and method for continuous crystal pullingJINKO GREEN ENERGY SHANGHAI MAN CO LTD·Filed 2020·Granted Aug 29, 2023·0 cites·20 claims
- 1349US11708643B2Method and apparatus for manufacturing monocrystalline siliconZHEJIANG JINKO SOLAR CO LTD·Filed 2020·Granted Jul 25, 2023·0 cites·10 claims
- 1446US10099339B2Chemical mechanical polishing (CMP) apparatus and methodSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2016·Granted Oct 16, 2018·0 cites·20 claims
- 1544US11631511B2Thermistor chip and preparation method thereofDINGSENSE ELECTRONICS TECH CO LTD·Filed 2019·Granted Apr 18, 2023·0 cites·15 claims
- 1644US2014298898A1Testing apparatus and testing methodWISTRON CORP·Filed 2013·Application pending·0 cites
- 1740USD809398SPackageYANTAI SHUANGTA FOOD CO LTD·Filed 2015·Granted Feb 6, 2018·3 cites·1 claims
- 1840US8387233B2System for assembling components on a circuit boardYang jun-min·Filed 2010·Granted Mar 5, 2013·0 cites·9 claims
- 1940US2016303703A1Scanning Chemical Mechanical PolishingYANG JUN·Filed 2015·Application pending·0 cites
- 2037US9570338B2Method for forming isolation member in trench of semiconductor substrateSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2015·Granted Feb 14, 2017·0 cites·19 claims
- 2134US10134625B2Shallow trench isolation structure and fabricating method thereofSEMICONDUCTOR MFG INT BEIJING CORP·Filed 2016·Granted Nov 20, 2018·0 cites·20 claims
- 2234US2011155361A1Heat dissipation module and portable device having the heat dissipation moduleWISTRON CORP·Filed 2010·Application pending·0 cites
- 2332USD803699SPackageYANTAI SHUANGTA FOOD CO LTD·Filed 2015·Granted Nov 28, 2017·1 cites·1 claims
- 2432USD801186SPackageYANTAI SHUANGTA FOOD CO LTD·Filed 2015·Granted Oct 31, 2017·1 cites·1 claims
- 2530US10330539B2High precision high reliability and quick response thermosensitive chip and manufacturing method thereofEXSENSE ELECTRONICS TECH CO LTD·Filed 2015·Granted Jun 25, 2019·0 cites·9 claims
- 2622US2017250011A1Thermosensitive chip for composite electrodeEXSENSE ELECTRONICS TECH CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →