US2011155361A1PendingUtilityA1
Heat dissipation module and portable device having the heat dissipation module
Est. expiryDec 29, 2029(~3.4 yrs left)· nominal 20-yr term from priority
H10W 40/73F28F 3/12F28F 3/02
34
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Claims
Abstract
A heat dissipation module for lowering the temperature of a heating element is disclosed. The heat dissipation module comprises a heat dissipation module body, a container, and a liquid element. The heat dissipation module body is made of a heat conductive material; the container is installed in the heat dissipation module body; and the liquid element is disposed in the container. Therefore, when the heat dissipation module is in contact with the heating element, heat generated by the heating element is absorbed by the heat dissipation module body and the liquid element.
Claims
exact text as granted — not AI-modified1 . A heat dissipation module, used for lowering the temperature of a heating element, the heat dissipation module comprising:
a heat dissipation module body, made of a heat conductive material; a container, installed in the heat dissipation module body; and a liquid element, disposed in the container; wherein when the heat dissipation module is in contact with the heating element, heat generated by the heating element is absorbed by the heat dissipation module body and the liquid element so as to achieve an effect of lowering the temperature of the heating element.
2 . The heat dissipation module as claimed in claim 1 , wherein the pressure of the liquid element is substantially between 0.4 and 1 standard atmospheric pressure (atm).
3 . The heat dissipation module as claimed in claim 1 , wherein the container comprises a port, which is disposed on the exterior of the heat dissipation module body, the heat dissipation module further comprising an on/off element, which is separately connected to the port, and the pressure of the liquid element can reach a specific external pressure via the port.
4 . The heat dissipation module as claimed in claim 1 , wherein the container is a multi-layer or S-shaped structure installed in the heat dissipation module body.
5 . The heat dissipation module as claimed in claim 1 , wherein the liquid element is water.
6 . The heat dissipation module as claimed in claim 1 , wherein the heat dissipation module body comprises a plurality of fins.
7 . The heat dissipation module as claimed in claim 1 , wherein the heat conductive material is selected from the following material groups: aluminum, aluminum alloy, copper, copper alloy, silver and silver alloy.
8 . The heat dissipation module as claimed in claim 1 , wherein the heat dissipation module is a passive heat dissipation module.
9 . A portable device, comprising:
at least one heating element; and at least one heat dissipation module, connected to the at least one heating element, the at least one heat dissipation module comprising:
a heat dissipation module body, made of a heat conductive material;
a container, installed in the heat dissipation module body; and
a liquid element, disposed in the container;
wherein when the heat dissipation module is in contact with the heating element, heat generated by the heating element is absorbed by the heat dissipation module body and the liquid element so as to achieve an effect of lowering the temperature of the heating element.
10 . The portable device as claimed in claim 9 , wherein the pressure of the liquid element is substantially between 0.4 and 1 standard atmospheric pressure (atm).
11 . The portable device as claimed in claim 10 , wherein the container comprises a port, which is disposed on the exterior of the heat dissipation module body, the heat dissipation module further comprising an on/off element, which is separately connected to the port, and the pressure of the liquid element can reach a specific external pressure via the port.
12 . The portable device as claimed in claim 9 , wherein the container is a multi-layer or S-shaped structure installed in the heat dissipation module body.
13 . The portable device as claimed in claim 9 , wherein the liquid element is water.
14 . The portable device as claimed in claim 9 , wherein the heat conductive material is selected from the following material groups: aluminum, aluminum alloy, copper, copper alloy, silver, and silver alloy.
15 . The portable device as claimed in claim 9 , wherein the heat dissipation module body comprises a plurality of fins.Join the waitlist — get patent alerts
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