Inventor · disambiguated record
Cheng-Tang Huang
Also filed as: HUANG CHENG-TANG
8 granted patents·4 pending applications·31 citations·filing 2007–2012
81Inventor score
Top patents by PatentIndex Score
12 records- 0183US7888172B2Chip stacked structure and the forming methodCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Feb 15, 2011·15 cites·6 claims
- 0281US7969003B2Bump structure having a reinforcement memberCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Jun 28, 2011·11 cites·6 claims
- 0365US7656020B2Packaging conductive structure for a semiconductor substrate having a metallic layerCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Feb 2, 2010·3 cites·11 claims
- 0461US8211789B2Manufacturing method of a bump structure having a reinforcement memberHUANG CHENG-TANG·Filed 2011·Granted Jul 3, 2012·2 cites·5 claims
- 0551US7879651B2Packaging conductive structure and method for forming the sameCHIPMOS TECHNOLOGIES INC·Filed 2009·Granted Feb 1, 2011·0 cites·10 claims
- 0644US2012309186A1Conductive structure for a semiconductor integrated circuit and method for forming the sameCHYI J B·Filed 2012·Application pending·0 cites
- 0744US2009302465A1Die rearrangement package structure and method thereofHUANG CHENG-TANG·Filed 2008·Application pending·0 cites
- 0842US8319337B2Conductive structure for a semiconductor integrated circuit and method for forming the sameCHI CHUNG-PANG·Filed 2007·Granted Nov 27, 2012·0 cites·6 claims
- 0938US2011003431A1Method of die rearrangement package structure having patterned under bump metallurgic layer connecting metal leadHUANG CHENG-TANG·Filed 2010·Application pending·0 cites
- 1035US8274150B2Chip bump structure and method for forming the sameHUANG CHENG TANG·Filed 2011·Granted Sep 25, 2012·0 cites·12 claims
- 1131US9196553B2Semiconductor package structure and manufacturing method thereofLIAO TSUNG-JEN·Filed 2012·Granted Nov 24, 2015·0 cites·14 claims
- 1230US2013049198A1Semiconductor package structure and manufacturing method thereofLIAO TSUNG-JEN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →