Inventor · disambiguated record
Hiroki Takewaka
Also filed as: TAKEWAKA HIROKI
13 granted patents·9 pending applications·279 citations·filing 1999–2023
91Inventor score
Top patents by PatentIndex Score
22 records- 0195US6417575B2Semiconductor device and fabrication process thereforMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jul 9, 2002·125 cites·12 claims
- 0293US6727590B2Semiconductor device with internal bonding padRENESAS TECH CORP·Filed 2002·Granted Apr 27, 2004·100 cites·8 claims
- 0387US9391035B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Jul 12, 2016·3 cites·17 claims
- 0487US6448658B2Semiconductor device having improved interconnection-wiring structuresMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Sep 10, 2002·41 cites·6 claims
- 0586US2024021541A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0683US11810869B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2022·Granted Nov 7, 2023·0 cites·40 claims
- 0780US10923437B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Feb 16, 2021·1 cites·19 claims
- 0876US11482498B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2020·Granted Oct 25, 2022·0 cites·25 claims
- 0963US10283458B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted May 7, 2019·0 cites·18 claims
- 1061US9761541B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Sep 12, 2017·0 cites·8 claims
- 1150US6586838B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jul 1, 2003·4 cites·5 claims
- 1246US6888258B2Semiconductor device including copper interconnect line and bonding pad, and method of manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted May 3, 2005·2 cites·12 claims
- 1345US6645863B2Method of manufacturing semiconductor device and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 11, 2003·1 cites·15 claims
- 1438US2001017415A1Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
- 1537US2004188842A1Interconnect structureRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 1637US2012202344A1Manufacturing method of semiconductor deviceNOZUE MASARU·Filed 2012·Application pending·0 cites
- 1736US2010314620A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 1835US2004036098A1Semiconductor device including a capacitorMITSUBISHI ELECTRIC CORP·Filed 2003·Application pending·0 cites
- 1935US2003100177A1Method of manufacturing semiconductor deviceFiled 2002·Application pending·0 cites
- 2033US2004087137A1Method of manufacturing interconnection structure applied to semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Application pending·0 cites
- 2133US2002081836A1Contact structure, semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
- 2231US6214723B1Method of manufacturing a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Apr 10, 2001·2 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →