Inventor · disambiguated record
Hyuek Jae Lee
Also filed as: LEE HYUEK JAE
18 granted patents·5 pending applications·128 citations·filing 1998–2023
93Inventor score
Files withSAMSUNG ELECTRONICS CO LTD15KOREA ELECTRONICS TELECOMM2LEE HYUEK-JAE2BAE SANG-HYUN1KOREA ADVANCED INST SCI & TECH1
Top patents by PatentIndex Score
23 records- 0197US11145626B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 12, 2021·19 cites·6 claims
- 0296US11056432B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 6, 2021·14 cites·20 claims
- 0396US10886255B2Die stack structure, semiconductor package having the same and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 5, 2021·17 cites·20 claims
- 0491US11776916B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 3, 2023·2 cites·20 claims
- 0590US6902660B2Method of manufacturing printed circuit board and multi-layered PCBKOREA ADVANCED INST SCI & TECH·Filed 2002·Granted Jun 7, 2005·36 cites·10 claims
- 0685US11581257B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·1 cites·20 claims
- 0779US10535534B2Method of fabricating an interposerSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 14, 2020·2 cites·19 claims
- 0873US11018026B2Interposer, semiconductor package, and method of fabricating interposerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 25, 2021·1 cites·17 claims
- 0972US11088038B2Semiconductor package including test padSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 10, 2021·1 cites·11 claims
- 1070US2023395523A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1163US11887900B2Semiconductor package including test padSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·18 claims
- 1263US11887968B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·12 claims
- 1358US8563349B2Method of forming semiconductor deviceMYUNG JONG-YUN·Filed 2011·Granted Oct 22, 2013·2 cites·5 claims
- 1457US7884392B2Image sensor having through viaLEE HYUEK-JAE·Filed 2009·Granted Feb 8, 2011·2 cites·20 claims
- 1557US2024096728A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1656US6097529AApparatus for enhancing extinction ratio in optical NRZ-to-RZ converting system, and optical modulation system thereforKOREA ELECTRONICS TELECOMM·Filed 1998·Granted Aug 1, 2000·24 cites·3 claims
- 1751US7034989B2Optical wavelength conversion apparatus and method using injection locking of fabry-perot laser diodeSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 25, 2006·3 cites·8 claims
- 1847US2009256931A1Camera module, method of manufacturing the same, and electronic system having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1944US2014252626A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2041US2016082569A1Retainer and wafer carrier including the sameBAE SANG-HYUN·Filed 2015·Application pending·0 cites
- 2137US8304288B2Methods of packaging semiconductor devices including bridge patternsLEE HYUEK-JAE·Filed 2011·Granted Nov 6, 2012·0 cites·20 claims
- 2233US6934348B2Device for recovering burst-mode optical clockROSWIN CO LTD·Filed 2001·Granted Aug 23, 2005·0 cites·3 claims
- 2332US6594053B1Apparatus for controlling cycles of optical pulse stream based on time correlationKOREA ELECTRONICS TELECOMM·Filed 1999·Granted Jul 15, 2003·4 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →