Inventor · disambiguated record
Choong Kooi Chee
Also filed as: CHEE CHOONG K · CHEE CHOONG KOOI
26 granted patents·7 pending applications·83 citations·filing 2002–2025
94Inventor score
Top patents by PatentIndex Score
33 records- 0196US11652026B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2022·Granted May 16, 2023·2 cites·20 claims
- 0295US10903142B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2019·Granted Jan 26, 2021·8 cites·22 claims
- 0390US2025385161A1Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2025·Application pending·0 cites
- 0488US2024429131A1Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2024·Application pending·0 cites
- 0584US12112997B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 0683US12080628B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 0782US2025022774A1Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling sameALTERA CORP·Filed 2024·Application pending·0 cites
- 0881US11398415B2Stacked through-silicon vias for multi-device packagesINTEL CORP·Filed 2019·Granted Jul 26, 2022·3 cites·18 claims
- 0977US12237245B2Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling sameINTEL CORP·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 1076US9978735B2Interconnection of an embedded dieALTERA CORP·Filed 2016·Granted May 22, 2018·3 cites·20 claims
- 1175US11393741B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2021·Granted Jul 19, 2022·0 cites·11 claims
- 1272US12125768B2Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling sameALTERA CORP·Filed 2021·Granted Oct 22, 2024·0 cites·14 claims
- 1369US7151014B2Underfilling process in a molded matrix array package using flow front modifying solder resistINTEL CORP·Filed 2004·Granted Dec 19, 2006·12 cites·19 claims
- 1464US7005321B2Stress-compensation layers in contact arrays, and processes of making sameINTEL CORP·Filed 2004·Granted Feb 28, 2006·11 cites·29 claims
- 1561US6774471B2Protected bond fingersINTEL CORP·Filed 2002·Granted Aug 10, 2004·10 cites·23 claims
- 1660US11107751B2Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling sameINTEL CORP·Filed 2019·Granted Aug 31, 2021·0 cites·21 claims
- 1758US7212332B2Micro-electromechanical system (MEMS) polyelectrolyte gel network pumpINTEL CORP·Filed 2004·Granted May 1, 2007·11 cites·12 claims
- 1858US2024014099A1Integrated circuit device exposed die package structure with adhesiveMARVELL ASIA PTE LTD·Filed 2023·Application pending·0 cites
- 1956US8384223B2Backside mold process for ultra thin substrate and package on package assemblyINTEL CORP·Filed 2008·Granted Feb 26, 2013·2 cites·9 claims
- 2055US11805602B2Chip assembliesINTEL CORP·Filed 2020·Granted Oct 31, 2023·0 cites·20 claims
- 2154US7339276B2Underfilling process in a molded matrix array package using flow front modifying solder resistINTEL CORP·Filed 2002·Granted Mar 4, 2008·5 cites·31 claims
- 2254US7088010B2Chip packaging compositions, packages and systems made therewith, and methods of making sameINTEL CORP·Filed 2003·Granted Aug 8, 2006·7 cites·29 claims
- 2353US7262077B2Capillary underfill and mold encapsulation method and apparatusINTEL CORP·Filed 2003·Granted Aug 28, 2007·9 cites·27 claims
- 2451US11527481B2Stacked semiconductor package with flyover bridgeINTEL CORP·Filed 2020·Granted Dec 13, 2022·0 cites·17 claims
- 2548US11562959B2Embedded dual-sided interconnect bridges for integrated-circuit packagesINTEL CORP·Filed 2020·Granted Jan 24, 2023·0 cites·17 claims
- 2647US8835220B2Backside mold process for ultra thin substrate and package on package assemblyINTEL CORP·Filed 2013·Granted Sep 16, 2014·0 cites·14 claims
- 2747US2022344297A1Semiconductor package inhibiting viscous material spreadINPHI CORP·Filed 2021·Application pending·0 cites
- 2847US2015072474A1Backside mold process for ultra thin substrate and package on package assemblyINTEL CORP·Filed 2014·Application pending·0 cites
- 2945US9159714B2Package on wide I/O siliconINTEL CORP·Filed 2013·Granted Oct 13, 2015·0 cites·12 claims
- 3041US10136516B2Microelectronic device attachment on a reverse microelectronic packageINTEL CORP·Filed 2017·Granted Nov 20, 2018·0 cites·18 claims
- 3140US2008017976A1Capillary underfill and mold encapsulation method and apparatusINTEL CORP·Filed 2007·Application pending·0 cites
- 3237US7453622B2Micro-electromechanical system (mems) polyelectrolyte gel network pumpINTEL CORP·Filed 2007·Granted Nov 18, 2008·0 cites·6 claims
- 3335US9699904B2Microelectronic device attachment on a reverse microelectronic packageLOO HOWE YIN·Filed 2012·Granted Jul 4, 2017·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →