Inventor · disambiguated record

Chang-Fu Lin

Also filed as: LIN CHANG-FU

70 granted patents·19 pending applications·384 citations·filing 2000–2025

98Inventor score

Technology areasH10W G06F H01L H10D H04L

Files withSILICONWARE PRECISION INDUSTRIES CO LTD76 MEDIATEK INC4 LIN CHANG-FU3 SILICON INTEGRATED SYS CORP2 HUANG WEN-HOME1

Top patents by PatentIndex Score

89 records

0196US11764188B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Sep 19, 2023·7 cites·10 claims
0296US11676948B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Jun 13, 2023·6 cites·11 claims
0396US10062651B2Packaging substrate and electronic package having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Aug 28, 2018·48 cites·20 claims
0495US7102239B2Chip carrier for semiconductor chipSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Sep 5, 2006·98 cites·8 claims
0594US11532528B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Dec 20, 2022·3 cites·18 claims
0691US12255182B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Mar 18, 2025·1 cites·14 claims
0790US12027484B2Electronic package and carrier thereof and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Jul 2, 2024·2 cites·5 claims
0889US11482470B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Oct 25, 2022·2 cites·16 claims
0988US6849942B2Semiconductor package with heat sink attached to substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Feb 1, 2005·48 cites·11 claims
1087US7196414B2Semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Mar 27, 2007·12 cites·6 claims
1186US11164755B1Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Nov 2, 2021·2 cites·13 claims
1285US11056470B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Jul 6, 2021·3 cites·11 claims
1385US10863626B1Electronic package carrier structure thereof, and method for fabricating the carrier structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Dec 8, 2020·3 cites·12 claims
1485US10600708B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Mar 24, 2020·5 cites·8 claims
1585US10522453B2Substrate structure with filling material formed in concave portionSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Dec 31, 2019·4 cites·11 claims
1685US10510720B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Dec 17, 2019·5 cites·30 claims
1783US12278189B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·15 claims
1882US7863731B2Heat-dissipating structure and heat-dissipating semiconductor package having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Jan 4, 2011·10 cites·15 claims
1982US2025046771A1Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
2081US10361150B2Substrate construction and electronic package including the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jul 23, 2019·4 cites·30 claims
2180US2025210527A1Electronic Package and Manufacturing Method ThereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
2279US11810862B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·13 claims
2379US10741500B2Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Aug 11, 2020·3 cites·17 claims
2478US12176327B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·10 claims
2578US7177155B2Semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Feb 13, 2007·6 cites·5 claims
2677US11069661B1Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Jul 20, 2021·1 cites·18 claims
2777US6980438B2Semiconductor package with heat dissipating structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Dec 27, 2005·24 cites·20 claims
2875US12255165B2Electronic package and carrier thereof and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Mar 18, 2025·0 cites·7 claims
2975US10756438B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Aug 25, 2020·2 cites·7 claims
3073US12100642B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Sep 24, 2024·0 cites·17 claims
3173US2025246502A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
3272US11521930B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 6, 2022·0 cites·14 claims
3372US9842771B2Semiconductor device and fabrication method thereof and semiconductor structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Dec 12, 2017·3 cites·13 claims
3472US8194146B2Apparatuses for capturing and storing real-time imagesLIN CHANG-FU·Filed 2008·Granted Jun 5, 2012·6 cites·9 claims
3571US7299341B2Embedded system with instruction prefetching device, and method for fetching instructions in embedded systemsMEDIATEK INC·Filed 2006·Granted Nov 20, 2007·4 cites·20 claims
3671US7057276B2Semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jun 6, 2006·17 cites·17 claims
3770US7937520B2General purpose interface controller of resoure limited systemMEDIATEK INC·Filed 2008·Granted May 3, 2011·5 cites·16 claims
3869US8895366B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 25, 2014·2 cites·10 claims
3968US10950520B2Electronic package, method for fabricating the same, and heat dissipatorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Mar 16, 2021·1 cites·27 claims
4068US2023361091A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
4167US9013042B2Interconnection structure for semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Apr 21, 2015·3 cites·11 claims
4266US11792938B2Method for fabricating carrier structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Oct 17, 2023·0 cites·9 claims
4366US9900996B2Package substrate and structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 20, 2018·2 cites·17 claims
4465US11984379B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted May 14, 2024·0 cites·26 claims
4565US7203072B2Heat dissipating structure and semiconductor package with the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Apr 10, 2007·12 cites·18 claims
4664US8698326B2Semiconductor package and fabrication method thereofHUANG WEN-HOME·Filed 2007·Granted Apr 15, 2014·4 cites·10 claims
4764US6424189B1Apparatus and system for multi-stage event synchronizationSILICON INTEGRATED SYS CORP·Filed 2000·Granted Jul 23, 2002·11 cites·9 claims
4863US11227842B2Electronic package and substrate structure having chamfersSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Jan 18, 2022·0 cites·11 claims
4963US11101566B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Aug 24, 2021·0 cites·11 claims
5061US11289346B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·9 claims

Showing the top 50 of 89 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →