Electronic package and manufacturing method thereof

Abstract

An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.

1 .- 11 . (canceled) 
     
     
         12 . A method of manufacturing an electronic package, comprising:
 providing an electronic body having a first side and a second side opposite to each other, and including a base and a circuit portion formed on the base, wherein the second side is defined by the base, and the first side is defined by the circuit portion, and the base includes a plurality of conductive vias electrically connected to the circuit portion and exposed from the second side;   forming a plurality of first conductors and second conductors on the first side and the second side of the electronic body, respectively, wherein the first conductors are electrically connected to the circuit portion, and the second conductors are electrically connected with the conductive vias;   forming a bonding layer and an insulating layer on the first side and the second side of the electronic body, respectively, wherein the first conductors are covered by the bonding layer, and the second conductors are covered by the insulating layer to form an electronic structure;   disposing the electronic structure on a carrier with the bonding layer thereof, a plurality of conductive pillars being formed on the carrier;   forming an encapsulation layer on the carrier to cover the electronic structure and the conductive pillars, wherein the encapsulation layer has a first surface and a second surface opposite to each other, and the encapsulation layer is bonded to the carrier at the first surface thereof; and   removing the carrier.   
     
     
         13 . The method of  claim 12 , wherein the base of the electronic body is a silicon material. 
     
     
         14 . The method of  claim 12 , wherein the first conductors are metal pillars or solder materials. 
     
     
         15 . The method of  claim 12 , further comprising, before disposing the electronic structure on the carrier, forming auxiliary conductors on the first conductors with the auxiliary conductors being covered by the bonding layer. 
     
     
         16 . The method of  claim 12 , further comprising, before disposing the electronic structure on the carrier, exposing the first conductors from the bonding layer. 
     
     
         17 . The method of  claim 12 , wherein the second surface of the encapsulation layer is flush with ends of the conductive pillars, the insulating layer or the second conductors. 
     
     
         18 . The method of  claim 12 , wherein ends of the conductive pillars, the insulating layer or the second conductors are exposed from the second surface of the encapsulation layer. 
     
     
         19 . The method of  claim 12 , further comprising, after removing the carrier, forming a circuit structure on the first surface of the encapsulation layer to electrically connect the circuit structure with the electronic structure and the plurality of conductive pillars. 
     
     
         20 . The method of  claim 19 , wherein the first conductors are electrically connected with the circuit structure through conductive bumps. 
     
     
         21 .- 25 . (canceled)