Inventor · disambiguated record
Eric D. Perfecto
Also filed as: PERFECTO ERIC · PERFECTO ERIC D · PERFECTO ERIC DANIEL
59 granted patents·7 pending applications·1,420 citations·filing 1992–2023
99Inventor score
Top patents by PatentIndex Score
66 records- 0199US9853006B2Semiconductor device contact structure having stacked nickel, copper, and tin layersGLOBALFOUNDRIES INC·Filed 2016·Granted Dec 26, 2017·47 cites·17 claims
- 0298US9396991B2Multilayered contact structure having nickel, copper, and nickel-iron layersGLOBALFOUNDRIES INC·Filed 2014·Granted Jul 19, 2016·46 cites·15 claims
- 0395US8518741B1Wafer-to-wafer process for manufacturing a stacked structureIBM·Filed 2012·Granted Aug 27, 2013·17 cites·25 claims
- 0494US9607973B1Method for establishing interconnects in packages using thin interposersGLOBALFOUNDRIES INC·Filed 2015·Granted Mar 28, 2017·10 cites·10 claims
- 0594US8381966B2Flip chip assembly method employing post-contact differential heatingIBM·Filed 2011·Granted Feb 26, 2013·14 cites·17 claims
- 0693US6036809AProcess for releasing a thin-film structure from a substrateIBM·Filed 1999·Granted Mar 14, 2000·112 cites·15 claims
- 0793US5436412AInterconnect structure having improved metallizationIBM·Filed 1993·Granted Jul 25, 1995·148 cites·30 claims
- 0892US10438894B1Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devicesGLOBALFOUNDRIES INC·Filed 2018·Granted Oct 8, 2019·13 cites·20 claims
- 0992US10041183B2Electrodeposition systems and methods that minimize anode and/or plating solution degradationGLOBALFOUNDRIES INC·Filed 2017·Granted Aug 7, 2018·2 cites·19 claims
- 1092US8820612B2Injection molded solder process for forming solder bumps on substratesFEGER CLAUDIUS·Filed 2012·Granted Sep 2, 2014·13 cites·9 claims
- 1191US9084378B2Under ball metallurgy (UBM) for improved electromigrationIBM·Filed 2013·Granted Jul 14, 2015·11 cites·16 claims
- 1291US5898222ACapped copper electrical interconnectsIBM·Filed 1997·Granted Apr 27, 1999·95 cites·30 claims
- 1390US10002835B2Structure for establishing interconnects in packages using thin interposersGLOBALFOUNDRIES INC·Filed 2017·Granted Jun 19, 2018·6 cites·8 claims
- 1489US5549808AMethod for forming capped copper electrical interconnectsIBM·Filed 1995·Granted Aug 27, 1996·113 cites·30 claims
- 1588US9379007B2Electromigration-resistant lead-free solder interconnect structuresGLOBALFOUNDRIES INC·Filed 2013·Granted Jun 28, 2016·10 cites·20 claims
- 1688US5757079AMethod for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structureIBM·Filed 1995·Granted May 26, 1998·90 cites·8 claims
- 1788US5300403ALine width control in a radiation sensitive polyimideIBM·Filed 1992·Granted Apr 5, 1994·85 cites·16 claims
- 1887US6281452B1Multi-level thin-film electronic packaging structure and related methodIBM·Filed 1998·Granted Aug 28, 2001·53 cites·21 claims
- 1986US8466543B2Three dimensional stacked package structureFLEISCHMAN THOMAS J·Filed 2010·Granted Jun 18, 2013·13 cites·25 claims
- 2084US5534466AMethod of making area direct transfer multilayer thin film structureIBM·Filed 1995·Granted Jul 9, 1996·76 cites·19 claims
- 2182US8937009B2Far back end of the line metallization method and structuresIBM·Filed 2013·Granted Jan 20, 2015·6 cites·18 claims
- 2282US6183588B1Process for transferring a thin-film structure to a substrateIBM·Filed 1999·Granted Feb 6, 2001·52 cites·15 claims
- 2381US9576922B2Silver alloying post-chip joinGLOBALFOUNDRIES INC·Filed 2015·Granted Feb 21, 2017·4 cites·20 claims
- 2481US9324669B2Use of electrolytic plating to control solder wettingIBM·Filed 2014·Granted Apr 26, 2016·5 cites·16 claims
- 2581US8742578B2Solder volume compensation with C4 processARVIN CHARLES L·Filed 2012·Granted Jun 3, 2014·6 cites·10 claims
- 2681US5545927ACapped copper electrical interconnectsIBM·Filed 1995·Granted Aug 13, 1996·50 cites·8 claims
- 2780US6678949B2Process for forming a multi-level thin-film electronic packaging structureIBM·Filed 2001·Granted Jan 20, 2004·21 cites·8 claims
- 2879US6998327B2Thin film transfer join process and multilevel thin film moduleIBM·Filed 2002·Granted Feb 14, 2006·27 cites·12 claims
- 2975US6459160B1Package with low stress hermetic sealIBM·Filed 2002·Granted Oct 1, 2002·19 cites·26 claims
- 3074US6126761AProcess of controlling grain growth in metal filmsIBM·Filed 1998·Granted Oct 3, 2000·29 cites·5 claims
- 3173US8496159B2Injection molded solder process for forming solder bumps on substratesFEGER CLAUDIUS·Filed 2011·Granted Jul 30, 2013·3 cites·11 claims
- 3272US5310625AProcess for forming negative tone images of polyimides using base treatment of crosslinked polyamic esterIBM·Filed 1993·Granted May 10, 1994·24 cites·4 claims
- 3371US6342407B1Low stress hermetic sealIBM·Filed 2000·Granted Jan 29, 2002·15 cites·20 claims
- 3469US9689084B2Electrodeposition systems and methods that minimize anode and/or plating solution degradationGLOBALFOUNDRIES INC·Filed 2014·Granted Jun 27, 2017·0 cites·16 claims
- 3569US8493746B2Additives for grain fragmentation in Pb-free Sn-based solderARVIN CHARLES L·Filed 2010·Granted Jul 23, 2013·2 cites·14 claims
- 3669US6143117AProcess for transferring a thin-film structure to a temporary carrierIBM·Filed 1999·Granted Nov 7, 2000·28 cites·10 claims
- 3768US9190376B1Organic coating to inhibit solder wetting on pillar sidewallsIBM·Filed 2014·Granted Nov 17, 2015·2 cites·14 claims
- 3866US6099935AApparatus for providing solder interconnections to semiconductor and electronic packaging devicesIBM·Filed 1995·Granted Aug 8, 2000·24 cites·2 claims
- 3965US5747095AMethod for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packagesIBM·Filed 1997·Granted May 5, 1998·28 cites·10 claims
- 4064US12300615B2Infrared debond damage mitigation by copper fill patternIBM·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 4164US8197612B2Optimization of metallurgical properties of a solder jointBUSBY JAMES A·Filed 2008·Granted Jun 12, 2012·2 cites·15 claims
- 4263US9142501B2Under ball metallurgy (UBM) for improved electromigrationIBM·Filed 2014·Granted Sep 22, 2015·1 cites·23 claims
- 4362US12469787B2Resist patterned redistribution wiring on copper polyimide via layerIBM·Filed 2022·Granted Nov 11, 2025·0 cites·19 claims
- 4462US7199450B2Materials and method to seal vias in silicon substratesIBM·Filed 2005·Granted Apr 3, 2007·2 cites·7 claims
- 4562US6444919B1Thin film wiring scheme utilizing inter-chip site surface wiringIBM·Filed 1995·Granted Sep 3, 2002·29 cites·21 claims
- 4660US5705857ACapped copper electrical interconnectsIBM·Filed 1996·Granted Jan 6, 1998·20 cites·5 claims
- 4759US2025201638A1Structure for monitoring hybrid bonds in a semiconductor chip packageIBM·Filed 2023·Application pending·0 cites
- 4856US2024332239A1Hybrid bond integration for multi-die assemblyIBM·Filed 2023·Application pending·0 cites
- 4954US9728440B2Non-transparent microelectronic grade glass as a substrate, temporary carrier or waferIBM·Filed 2014·Granted Aug 8, 2017·0 cites·9 claims
- 5054US2024113055A1Structure for hybrid bond crackstop with airgapsIBM·Filed 2022·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
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