Inventor · disambiguated record
Harry D. Cox
Also filed as: COX HARRY · COX HARRY D · COX HARRY DAVID
33 granted patents·4 pending applications·270 citations·filing 1995–2023
97Inventor score
Top patents by PatentIndex Score
37 records- 0199US9853006B2Semiconductor device contact structure having stacked nickel, copper, and tin layersGLOBALFOUNDRIES INC·Filed 2016·Granted Dec 26, 2017·47 cites·17 claims
- 0298US9396991B2Multilayered contact structure having nickel, copper, and nickel-iron layersGLOBALFOUNDRIES INC·Filed 2014·Granted Jul 19, 2016·46 cites·15 claims
- 0397US9401336B2Dual layer stack for contact formationIBM·Filed 2014·Granted Jul 26, 2016·48 cites·17 claims
- 0496US8177945B2Multi-anode system for uniform plating of alloysARVIN CHARLES L·Filed 2007·Granted May 15, 2012·17 cites·20 claims
- 0594US9607973B1Method for establishing interconnects in packages using thin interposersGLOBALFOUNDRIES INC·Filed 2015·Granted Mar 28, 2017·10 cites·10 claims
- 0693US8803317B2Structures for improving current carrying capability of interconnects and methods of fabricating the sameARVIN CHARLES L·Filed 2012·Granted Aug 12, 2014·5 cites·15 claims
- 0792US10041183B2Electrodeposition systems and methods that minimize anode and/or plating solution degradationGLOBALFOUNDRIES INC·Filed 2017·Granted Aug 7, 2018·2 cites·19 claims
- 0890US10002835B2Structure for establishing interconnects in packages using thin interposersGLOBALFOUNDRIES INC·Filed 2017·Granted Jun 19, 2018·6 cites·8 claims
- 0982US8338286B2Dimensionally decoupled ball limiting metalurgyPERFECTO ERIC DAVID·Filed 2010·Granted Dec 25, 2012·10 cites·15 claims
- 1080US6706621B2Wafer integrated rigid support ringIBM·Filed 2002·Granted Mar 16, 2004·29 cites·12 claims
- 1179US9035459B2Structures for improving current carrying capability of interconnects and methods of fabricating the sameARVIN CHARLES L·Filed 2009·Granted May 19, 2015·1 cites·10 claims
- 1271US9679796B2Anodized metal on carrier waferIBM·Filed 2014·Granted Jun 13, 2017·2 cites·19 claims
- 1369US9689084B2Electrodeposition systems and methods that minimize anode and/or plating solution degradationGLOBALFOUNDRIES INC·Filed 2014·Granted Jun 27, 2017·0 cites·16 claims
- 1468US8623194B2Multi-anode system for uniform plating of alloysARVIN CHARLES L·Filed 2012·Granted Jan 7, 2014·0 cites·18 claims
- 1566US8551303B2Multi-anode system for uniform plating of alloysARVIN CHARLES L·Filed 2012·Granted Oct 8, 2013·0 cites·20 claims
- 1666US7287468B2Nickel alloy plated structureIBM·Filed 2005·Granted Oct 30, 2007·3 cites·26 claims
- 1765US9347147B2Method and apparatus for controlling and monitoring the potentialARVIN CHARLES L·Filed 2012·Granted May 24, 2016·0 cites·16 claims
- 1862US6631675B2Screening method for double pass screeningIBM·Filed 2001·Granted Oct 14, 2003·5 cites·8 claims
- 1960US12474519B2Photonics chip patterning with multiple photoresist layersGLOBALFOUNDRIES US INC·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 2059US9062388B2Method and apparatus for controlling and monitoring the potentialARVIN CHARLES L·Filed 2010·Granted Jun 23, 2015·0 cites·9 claims
- 2158US7278459B2Common carrierIBM·Filed 2004·Granted Oct 9, 2007·5 cites·22 claims
- 2257US7472650B2Nickel alloy plated structureIBM·Filed 2007·Granted Jan 6, 2009·1 cites·12 claims
- 2355US6348233B2Method of forming conductive line features for enhanced reliability of multi-layer ceramic substratesIBM·Filed 2001·Granted Feb 19, 2002·7 cites·9 claims
- 2454US9728440B2Non-transparent microelectronic grade glass as a substrate, temporary carrier or waferIBM·Filed 2014·Granted Aug 8, 2017·0 cites·9 claims
- 2554US8020599B2Common carrierIBM·Filed 2007·Granted Sep 20, 2011·0 cites·14 claims
- 2654US7879171B2Common carrierIBM·Filed 2007·Granted Feb 1, 2011·0 cites·13 claims
- 2751US6662718B2Screening mask having a stress-relieving areaIBM·Filed 2001·Granted Dec 16, 2003·2 cites·16 claims
- 2851US2015311161A1Selective plating without photoresistIBM·Filed 2014·Application pending·0 cites
- 2949US9804498B2Filtering lead from photoresist stripping solutionIBM·Filed 2014·Granted Oct 31, 2017·0 cites·20 claims
- 3048US5669972AFlex tab thick film metal maskIBM·Filed 1995·Granted Sep 23, 1997·10 cites·10 claims
- 3146US7683493B2Intermetallic diffusion block device and method of manufactureIBM·Filed 2008·Granted Mar 23, 2010·0 cites·7 claims
- 3246US7138326B2Wafer integrated rigid support ringIBM·Filed 2003·Granted Nov 21, 2006·3 cites·7 claims
- 3345US2007045830A1Wafer integrated rigid support ringIBM·Filed 2006·Application pending·0 cites
- 3445US2015348910A1Selective plating without photoresistIBM·Filed 2015·Application pending·0 cites
- 3543US2006243700A1Composite electroformed screening mask and method of making the sameIBM·Filed 2005·Application pending·0 cites
- 3636US6217989B1Conductive line features for enhanced reliability of multi-layer ceramic substratesIBM·Filed 1999·Granted Apr 17, 2001·6 cites·25 claims
- 3736US5807610AFlex tab thick film metal mask to deposit coating materialIBM·Filed 1997·Granted Sep 15, 1998·5 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →