Inventor · disambiguated record
Chih-Huang Chang
Also filed as: CHANG CHIH Y · CHANG CHIH-HUANG
14 granted patents·12 pending applications·278 citations·filing 1995–2009
93Inventor score
Top patents by PatentIndex Score
26 records- 0196US7015571B2Multi-chips module assembly packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 21, 2006·105 cites·21 claims
- 0288US7602053B2Leadframe of a leadless flip-chip package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Oct 13, 2009·15 cites·34 claims
- 0381US7790505B2Semiconductor chip package manufacturing method and structure thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Sep 7, 2010·13 cites·7 claims
- 0481US6864168B2Bump and fabricating process thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 8, 2005·25 cites·9 claims
- 0580US7019407B2Flip chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 28, 2006·31 cites·8 claims
- 0680US6819002B2Under-ball-metallurgy layerADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 16, 2004·28 cites·19 claims
- 0777US7312105B2Leadframe of a leadless flip-chip package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Dec 25, 2007·7 cites·8 claims
- 0868US7221041B2Multi-chips module package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 22, 2007·13 cites·15 claims
- 0955US6891274B2Under-bump-metallurgy layer for improving adhesionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted May 10, 2005·6 cites·25 claims
- 1053US7049689B2Chip on glass packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 23, 2006·6 cites·24 claims
- 1152US2004138960A1Online entrusting systemFiled 2003·Application pending·0 cites
- 1248USD577808SElectric fanCHANG CHIH-HUANG·Filed 2007·Granted Sep 30, 2008·9 cites·1 claims
- 1348US2007176269A1Multi-chips module package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 1446US5558397ARocking chairCOLLINS CO LTD·Filed 1995·Granted Sep 24, 1996·18 cites·1 claims
- 1545US2005200014A1Bump and fabricating process thereofFiled 2005·Application pending·0 cites
- 1642US2009068010A1Electric fan structureCHANG CHIH-HUANG·Filed 2007·Application pending·0 cites
- 1741US7222124B2Internet automatic electric data systemADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted May 22, 2007·1 cites·15 claims
- 1840US2006046904A1TreadmillCHANG CHIH Y·Filed 2004·Application pending·0 cites
- 1940US2004065949A1[solder bump]Filed 2003·Application pending·0 cites
- 2040US2006022316A1Semiconductor package with flip chip on leadless leadframeADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 2139US2010184255A1Manufacturing method for package structureLIU CHIEN·Filed 2009·Application pending·0 cites
- 2237US2004065964A1Semiconductor package with thermal enhance film and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
- 2337US2004124512A1Thermal enhance MCM packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
- 2434US2005087864A1Cavity-down semiconductor package with heat spreaderADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 2532USD390366SRocking armchairCOLLINS CO LTD·Filed 1996·Granted Feb 10, 1998·1 cites·1 claims
- 2630US2004207065A1[stack-type multi-chip package and method of fabricating bumps on the backside of a chip]Filed 2004·Application pending·0 cites
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