Multi-chips module package and manufacturing method thereof

Abstract

A multi-chips module package comprises a lead frame, a first chip, a second chip, a plurality of electrically conductive wires and an encapsulation. The lead frame has a plurality of first leads, second leads and chip pads connecting to the first leads. The first chip is placed on the lead frame and electrically connected to the lead frame through the bumps connecting the bump-bonding pads and the chip pads and the first leads; the second chip is placed over the first chip and electrically connected to the lead frame through the wires connecting the wire-bonding pads to the second leads; and the encapsulation covers the first chip, the second chip, the lead frame, and the wires. In such a manner, it not only reduces the distance of transmitting the electrical signals from chips to the outside but also it can save cost due to the lead frame manufactured by a simple manufacturing processes. In addition, a manufacturing method of the multi-chips module package is provided.

1 - 17 . (canceled)  
     
     
         18 . A manufacturing method of multi-chips module packages, comprising: 
 providing a first chip, the chip having a first active surface, a first back surface and a plurality of bump-bonding pads formed on the first active surface;    forming a plurality of bumps over the bump-bonding pads;    providing a second chip, the chip having a second active surface, a second back surface and a plurality of wire-bonding pads formed on the second active surface;    providing a lead frame strip, the lead frame strip having a plurality of lead frame and said each lead frame having first leads, second leads and a plurality of chip pads connecting to the first leads;    placing the first chip over the chip pads and connecting the first chip and the chip pads through the bumps;    placing the second chip over the first chip;    providing a plurality of wires to connect the wire-bonding pads and the second leads;    forming an encapsulation to cover the first chip, the second chip, the wires and the chip pads to form a plurality of semi-finished multi-chips module packages, wherein a portion of the first leads and the second leads are exposed out of the encapsulation; and    singulating the lead frame strip to have the semi-finished multi-chips module packages separated into a plurality of the multi-chips module packages. The method of  claim 18 , further comprising steps of:    providing a plurality of tapes attached to the portions of the first leads and the second leads; and    removing the taps to leave the portions of the first leads and the second leads exposed out of the encapsulation after performing the step of forming an encapsulation.    
     
     
         19 . The method of  claim 18 , further comprising a step of forming under bump metallurgy layers on the bump-bonding pads.  
     
     
         20 . The method of  claim 18 , further comprising a step of etching the first leads and the second leads to form a plurality of reentrant portions on the first leads and the second leads.  
     
     
         21 . The method of  claim 18 , further comprising a step of forming gold layers on the second leads.  
     
     
         22 . The method of  claim 18 , further comprising a step of forming gold layers on the second leads.  
     
     
         23 . The method of  claim 18 , further forming a recess on the chip pad.  
     
     
         24 . The method of  claim 23 , further filling a solder material in the recess.  
     
     
         25 - 30 . (canceled)