Inventor · disambiguated record
Chian-Chi Lin
Also filed as: LIN CHIAN-CHI
14 granted patents·7 pending applications·342 citations·filing 2003–2009
93Inventor score
Technology areasH10W
Top patents by PatentIndex Score
21 records- 0195US7741152B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 22, 2010·44 cites·11 claims
- 0295US7002805B2Thermal enhance MCM package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 21, 2006·112 cites·12 claims
- 0394US7528053B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted May 5, 2009·31 cites·22 claims
- 0493US7642132B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 5, 2010·24 cites·20 claims
- 0590US7446404B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Nov 4, 2008·18 cites·8 claims
- 0687US7045391B2Multi-chips bumpless assembly package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 16, 2006·53 cites·16 claims
- 0781US7790505B2Semiconductor chip package manufacturing method and structure thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Sep 7, 2010·13 cites·7 claims
- 0878US8288853B2Three-dimensional package and method of making the sameHUANG MIN-LUNG·Filed 2009·Granted Oct 16, 2012·9 cites·10 claims
- 0973US7547575B2Two-stage die-bonding method for simultaneous die-bonding of multiple diesADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jun 16, 2009·7 cites·6 claims
- 1068US7445944B2Packaging substrate and manufacturing method thereofASE SHANGHAI INC·Filed 2006·Granted Nov 4, 2008·5 cites·14 claims
- 1168US7221041B2Multi-chips module package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 22, 2007·13 cites·15 claims
- 1266US7945062B2Microelectromechanical microphone packaging systemADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted May 17, 2011·3 cites·7 claims
- 1359US7223683B2Wafer level bumping processADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 29, 2007·9 cites·20 claims
- 1455US7581666B2Wire-bonding method for wire-bonding apparatusADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Sep 1, 2009·1 cites·6 claims
- 1548US2007176269A1Multi-chips module package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 1642US2007090508A1Multi-chip package structureLIN CHIAN-CHI·Filed 2006·Application pending·0 cites
- 1741US2008044931A1Packaging substrate and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1841US2007090507A1Multi-chip package structureLIN CHIAN-CHI·Filed 2006·Application pending·0 cites
- 1940US2008035706A1Wire-bonding apparatus and wire-bonding method thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 2037US2004065964A1Semiconductor package with thermal enhance film and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
- 2137US2004124512A1Thermal enhance MCM packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →