Inventor · disambiguated record
Genki Yano
Also filed as: YANO GENKI
14 granted patents·5 pending applications·46 citations·filing 2013–2025
89Inventor score
Files withTEXAS INSTRUMENTS INC19
Top patents by PatentIndex Score
19 records- 0195US9896330B2Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 20, 2018·12 cites·20 claims
- 0294US10658240B1Semiconductor die singulationTEXAS INSTRUMENTS INC·Filed 2019·Granted May 19, 2020·12 cites·26 claims
- 0391US9230862B2Wafer die separationTEXAS INSTRUMENTS INC·Filed 2013·Granted Jan 5, 2016·11 cites·9 claims
- 0488US10233074B2Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 19, 2019·4 cites·17 claims
- 0582US11498831B2Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2020·Granted Nov 15, 2022·1 cites·7 claims
- 0682US10723616B2Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 28, 2020·2 cites·19 claims
- 0778US9543206B2Wafer die separationTEXAS INSTRUMENTS INC·Filed 2015·Granted Jan 10, 2017·2 cites·9 claims
- 0871US12198982B2Laser dicing for singulationTEXAS INSTRUMENTS INC·Filed 2022·Granted Jan 14, 2025·0 cites·15 claims
- 0970US10763230B2Integrated circuit backside metallizationTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 1, 2020·1 cites·8 claims
- 1067US11171031B2Die matrix expander with partitioned subringTEXAS INSTRUMENTS INC·Filed 2018·Granted Nov 9, 2021·1 cites·20 claims
- 1167US2023260839A1Front side laser-based wafer dicingTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1267US2025157858A1Laser dicing for singulationTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 1365US11367699B2Integrated circuit backside metallizationTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 21, 2022·0 cites·19 claims
- 1461US11482442B2Subring for semiconductor diesTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 25, 2022·0 cites·15 claims
- 1557US11469141B2Laser dicing for singulationTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 11, 2022·0 cites·7 claims
- 1657US2025309084A1Semiconductor packages with compact lead designTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1755US11664276B2Front side laser-based wafer dicingTEXAS INSTRUMENTS INC·Filed 2018·Granted May 30, 2023·0 cites·18 claims
- 1848US2020075386A1Subring for semiconductor diesTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 1931US2016035652A1Integrated Circuit Device With Wire Bond ConnectionsTEXAS INSTRUMENTS INC·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →