Subring for semiconductor dies

Abstract

A subring for holding tape connected to semiconductor dies and spanning a passage in a frame having a first diameter includes a base. An opening extends through the base and has a second diameter at least as large as the first diameter. A projection extends from the base to ends positioned on opposite sides of the base. The projection is adapted to clamp the tape to the frame and adapted to prevent relative movement between the tape, the subring, and the frame.

What is claimed is: 
     
         1 . A subring for holding tape connected to semiconductor dies and spanning a passage in a frame having a first diameter, comprising:
 a base;   an opening extending through the base and having a second diameter at least as large as the first diameter; and   a projection extending from the base to ends positioned on opposite sides of the base, the projection being adapted to clamp the tape in an expanded condition to the frame and adapted to prevent relative movement between the tape, the subring, and the frame.   
     
     
         2 . The subring of  claim 1 , wherein the ends of the projection are rounded. 
     
     
         3 . The subring of  claim 1 , wherein the second diameter is larger than the first diameter. 
     
     
         4 . The subring of  claim 1  comprising discrete sections held together by a cap such that the tape is clamped between the cap and the subring. 
     
     
         5 . The subring of  claim 4 , wherein the cap includes an annular recess for receiving one of the ends of the projection such that the tape is clamped between the cap and the projection. 
     
     
         6 . The subring of  claim 1 , wherein the projection is received in a recess in the frame such that the tape is clamped between the projection and the frame. 
     
     
         7 . The subring of  claim 1 , wherein the opposite ends of the projection are configured to engage the tape. 
     
     
         8 . The subring of  claim 1 , wherein the ends of the projection are formed from metal. 
     
     
         9 . A system for holding tape connected to semiconductor dies, comprising:
 a frame having opposing first and second surfaces and a passage extending from the first surface to the second surface, the passage having a first diameter and the tape being attached to the second surface to align the dies with the passage;   a subring formed from sections and comprising:
 a base; 
 an opening extending through the base and having a second diameter at least as large as the first diameter; and 
 a projection extending from the base to ends positioned on opposite sides of the base, the projection being adapted to clamp the tape in an expanded condition to the frame and being adapted to prevent relative movement between the tape, the subring, and the frame; and 
   a cap positioned over the projection for holding the sections together and being adapted to clamp the tape between the cap and the projection.   
     
     
         10 . The system of  claim 9 , wherein the ends of the projection are rounded. 
     
     
         11 . The system of  claim 9 , wherein the second diameter is larger than the first diameter. 
     
     
         12 . The system of  claim 9 , wherein the cap includes an annular recess for receiving one of the ends of the projection such that the tape is clamped between the cap and the projection. 
     
     
         13 . The system of  claim 9 , wherein the frame includes a recess formed in the first surface for receiving the projection such that the tape is clamped between the projection and the frame. 
     
     
         14 . The system of  claim 9 , wherein the opposite ends of the projection are configured to engage the tape. 
     
     
         15 . The system of  claim 9 , wherein the ends of the projection are formed from metal. 
     
     
         16 . A method of forming an integrated circuit, comprising the steps of:
 providing holding tape connected to semiconductor dies;   securing the tape to a first surface of a frame having a passage with a first diameter such that the dies are aligned with the passage;   inserting sections of a subring through the passage to expand the tape and move the dies through the passage to a position axially spaced from a second surface of the frame opposing the first surface;   assembling the sections into the subring such that the expanded tape is clamped between the subring and the frame, the assembled subring having an opening with a second diameter at least as large as the first diameter of the passage;   passing a chuck through the opening and the passage to further expand the tape and space the dies a predetermined distance from one another;   picking one of the dies from the expanded tape; and   electrically connecting leads to the die.   
     
     
         17 . The method of  claim 16 , further comprising inserting a projection on the assembled subring into a recess in the second surface of the frame to clamp the tape between the projection and the frame. 
     
     
         18 . The method of  claim 16 , further comprising positioning a cap over the projection to hold the sections together and clamp the tape between the projection and the cap. 
     
     
         19 . The method of  claim 16 , further comprising positioning a cap over the assembled subring to hold the sections together and clamp the tape between the cap and subring. 
     
     
         20 . The method of  claim 16 , wherein the semiconductor dies have a footprint less than 500×500 μm.