Inventor · disambiguated record
Kimball M. Watson
Also filed as: WATSON KIMBALL M · Watson Kimball
24 granted patents·2 pending applications·100 citations·filing 1994–2015
94Inventor score
Files withIBM17VOEGELI BENJAMIN T2AYOTTE STEPHEN PETER1COLLINS DAVID S1FEILCHENFELD NATALIE BARBARA1
Top patents by PatentIndex Score
26 records- 0187US7904273B2In-line depth measurement for thru silicon viaIBM·Filed 2009·Granted Mar 8, 2011·11 cites·20 claims
- 0279US7904868B2Structures including means for lateral current carrying capability improvement in semiconductor devicesIBM·Filed 2007·Granted Mar 8, 2011·8 cites·7 claims
- 0374US7453151B2Methods for lateral current carrying capability improvement in semiconductor devicesIBM·Filed 2006·Granted Nov 18, 2008·5 cites·6 claims
- 0473US8486796B2Thin film resistors and methods of manufactureHARMON DAVID L·Filed 2010·Granted Jul 16, 2013·4 cites·19 claims
- 0571US8089160B2IC interconnect for high currentWANG PING-CHUAN·Filed 2007·Granted Jan 3, 2012·5 cites·7 claims
- 0668US8234606B2Metal wiring structure for integration with through substrate viasCOLLINS DAVID S·Filed 2011·Granted Jul 31, 2012·2 cites·20 claims
- 0767US8592947B2Thermally controlled refractory metal resistorLUKAITIS JOSEPH M·Filed 2010·Granted Nov 26, 2013·2 cites·16 claims
- 0866US7981732B2Programming of laser fuseIBM·Filed 2008·Granted Jul 19, 2011·2 cites·8 claims
- 0964US8125019B2Electrically programmable resistorVOEGELI BENJAMIN T·Filed 2006·Granted Feb 28, 2012·3 cites·10 claims
- 1064US7968975B2Metal wiring structure for integration with through substrate viasIBM·Filed 2008·Granted Jun 28, 2011·2 cites·25 claims
- 1164US7919834B2Edge seal for thru-silicon-via technologyIBM·Filed 2007·Granted Apr 5, 2011·4 cites·9 claims
- 1264US7384824B2Structure and programming of laser fuseIBM·Filed 2006·Granted Jun 10, 2008·2 cites·5 claims
- 1361US9496110B2Micro-electro-mechanical system (MEMS) structure and design structuresIBM·Filed 2013·Granted Nov 15, 2016·1 cites·19 claims
- 1460US5533197AMethod to assess electromigration and hot electron reliability for microprocessorsIBM·Filed 1994·Granted Jul 2, 1996·23 cites·12 claims
- 1558US7064409B2Structure and programming of laser fuseIBM·Filed 2003·Granted Jun 20, 2006·6 cites·7 claims
- 1654US9059051B2Inline measurement of through-silicon via depthIBM·Filed 2013·Granted Jun 16, 2015·0 cites·11 claims
- 1754US8765568B2Method of fabricating thermally controlled refractory metal resistorIBM·Filed 2013·Granted Jul 1, 2014·0 cites·20 claims
- 1853US8017514B2Optically transparent wires for secure circuits and methods of making sameIBM·Filed 2008·Granted Sep 13, 2011·0 cites·14 claims
- 1951US9568538B1Matching of bipolar transistor pair through electrical stressIBM·Filed 2015·Granted Feb 14, 2017·0 cites·20 claims
- 2051US2008308940A1Lateral current carrying capability improvement in semiconductor devicesFEILCHENFELD NATALIE BARBARA·Filed 2008·Application pending·0 cites
- 2148US9865514B2Inline measurement of through-silicon via depthGLOBALFOUNDRIES INC·Filed 2015·Granted Jan 9, 2018·0 cites·9 claims
- 2245US8686478B2Methods of forming and programming an electronically programmable resistorVOEGELI BENJAMIN T·Filed 2011·Granted Apr 1, 2014·0 cites·19 claims
- 2345US7919830B2Method and structure for ballast resistorIBM·Filed 2008·Granted Apr 5, 2011·0 cites·2 claims
- 2445US5634001AMethod to calculate hot-electron test voltage differential for assessing microprocessor reliabilityIBM·Filed 1995·Granted May 27, 1997·20 cites·9 claims
- 2543US8207609B2Optically transparent wires for secure circuits and methods of making sameAYOTTE STEPHEN PETER·Filed 2011·Granted Jun 26, 2012·0 cites·14 claims
- 2637US2003146492A1Nitride etchstop film to protect metal-insulator-metal capacitor dielectric from degradation and method for making sameIBM·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →