Inventor · disambiguated record
Wen-Ming Chen
Also filed as: CHEN WEN-MING
27 granted patents·8 pending applications·61 citations·filing 2002–2024
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD16HONGFUJIN PREC IND SHENZHEN7TAIWAN SEMICONDUCTOR MFG6HUNG CHUN-LUNG3CHEN WEN-MING1
Top patents by PatentIndex Score
35 records- 0193US10014218B1Method for forming semiconductor device structure with bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 3, 2018·13 cites·20 claims
- 0291US11367658B2Semiconductor die singulation and structures formed therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 21, 2022·2 cites·20 claims
- 0387US10535554B2Semiconductor die having edge with multiple gradients and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 14, 2020·3 cites·20 claims
- 0483US10510605B2Semiconductor die singulation and structures formed therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·2 cites·19 claims
- 0583US2024363398A1Semiconductor die having edge with multiple gradientsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0681US8387222B2Pen barrel assembling deviceCHEN WEN-MING·Filed 2010·Granted Mar 5, 2013·16 cites·10 claims
- 0780US10720360B2Semiconductor die singulation and structures formed therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 21, 2020·2 cites·20 claims
- 0877US11211318B2Bump layout for coplanarity improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·3 cites·19 claims
- 0974US10741513B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 11, 2020·1 cites·20 claims
- 1073US12087618B2Method for forming semiconductor die having edge with multiple gradientsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
- 1170US11004728B2Semiconductor die having edge with multiple gradients and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 11, 2021·0 cites·20 claims
- 1269US11527504B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 1364US6723201B2Microchip fabrication chamber wafer detectionTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 20, 2004·9 cites·6 claims
- 1462US7804195B2Power supply system and protection methodHONGFUJIN PREC IND SHENZHEN·Filed 2008·Granted Sep 28, 2010·6 cites·19 claims
- 1557US10163836B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·0 cites·20 claims
- 1655US11349742B2Modem and communication methodPEGATRON CORP·Filed 2019·Granted May 31, 2022·0 cites·8 claims
- 1753US9875979B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 23, 2018·0 cites·22 claims
- 1853US8086095B2Audio and video apparatus and method for controlling the sameHUNG CHUN-LUNG·Filed 2008·Granted Dec 27, 2011·0 cites·10 claims
- 1951US2009257730A1Video server, video client device and video processing method thereofHONGFUJIN PREC IND SHENZHEN·Filed 2009·Application pending·0 cites
- 2047US2009235197A1System and method for password entryHONGFUJIN PREC IND SHENZHEN·Filed 2009·Application pending·0 cites
- 2144US8073161B2Audio apparatusHUNG CHUN-LUNG·Filed 2008·Granted Dec 6, 2011·0 cites·20 claims
- 2244US7663433B2Audio amplifierHONGFUJIN PREC IND SHENZHEN·Filed 2008·Granted Feb 16, 2010·1 cites·10 claims
- 2344US2009168822A1Laser control apparatus and electronic device using the sameHONGFUJIN PREC IND SHENZHEN·Filed 2008·Application pending·0 cites
- 2443US8072784B2Electronic device and power supply unit thereofHUNG CHUN-LUNG·Filed 2008·Granted Dec 6, 2011·0 cites·17 claims
- 2543US7916440B2Power interface circuit and electronic device using the sameHONGFUJIN PREC IND SHENZHEN·Filed 2008·Granted Mar 29, 2011·0 cites·11 claims
- 2641US6822575B2Backfill prevention system for gas flow conduitTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 23, 2004·3 cites·16 claims
- 2740US10312118B2Bonding apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 4, 2019·0 cites·17 claims
- 2839US10861761B2Semiconductor packaged wafer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·0 cites·20 claims
- 2939US9748130B2Wafer taping schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 29, 2017·0 cites·22 claims
- 3038US2005284572A1Heating system for load-lock chamberTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 3137US2003173189A1Stocker conveyor particle removing systemTAIWAN SEMICONDUCTOR MFG·Filed 2002·Application pending·0 cites
- 3236US2009134934A1Electronic deviceHONGFUJIN PREC IND SHENZHEN·Filed 2008·Application pending·0 cites
- 3328US7396432B2Composite shadow ring assembled with dowel pins and method of usingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 8, 2008·0 cites·10 claims
- 3427US2004025940A1Balance switch for controlling gasTAIWAN SEMICONDUCTOR MFG·Filed 2002·Application pending·0 cites
- 3525US8859246B2Method to produce PHBV by recombinant Escherichia coliCHIEN CHIH-CHING·Filed 2012·Granted Oct 14, 2014·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →