Inventor · disambiguated record
Linan Ji
Also filed as: JI LINAN
9 granted patents·3 pending applications·100 citations·filing 2008–2015
87Inventor score
Top patents by PatentIndex Score
12 records- 0195US7838425B2Method of treating surface of semiconductor substrateTOSHIBA KK·Filed 2008·Granted Nov 23, 2010·27 cites·9 claims
- 0295US7749909B2Method of treating a semiconductor substrateTOSHIBA KK·Filed 2009·Granted Jul 6, 2010·46 cites·24 claims
- 0392US7985683B2Method of treating a semiconductor substrateTOSHIBA KK·Filed 2010·Granted Jul 26, 2011·13 cites·30 claims
- 0479US8771429B2Supercritical drying method for semiconductor substrate and supercritical drying apparatusJI LINAN·Filed 2012·Granted Jul 8, 2014·5 cites·8 claims
- 0576US8950082B2Supercritical drying method for semiconductor substrateSATO YOHEI·Filed 2012·Granted Feb 10, 2015·3 cites·13 claims
- 0673US9583330B2Supercritical drying method for semiconductor substrate and supercritical drying apparatusTOKYO ELECTRON LTD·Filed 2014·Granted Feb 28, 2017·2 cites·4 claims
- 0767US9570286B2Supercritical drying method for semiconductor substrateTOSHIBA KK·Filed 2015·Granted Feb 14, 2017·1 cites·17 claims
- 0864US8567420B2Cleaning apparatus for semiconductor waferINUKAI MINAKO·Filed 2009·Granted Oct 29, 2013·3 cites·20 claims
- 0948US2010044343A1Substrate treatment apparatus and substrate treatment methodTOMITA HIROSHI·Filed 2009·Application pending·0 cites
- 1043US8961696B2Method and device for cleaning semiconductor substrateTOMITA HIROSHI·Filed 2012·Granted Feb 24, 2015·0 cites·7 claims
- 1142US2009250431A1Substrate processing apparatus and substrate processing methodINUKAI MINAKO·Filed 2009·Application pending·0 cites
- 1239US2013061492A1Supercritical drying method and supercritical drying apparatus for semiconductor substrateOKUCHI HISASHI·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Linan Ji files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →