Inventor · disambiguated record
Kiran V. Thadani
Also filed as: THADANI KIRAN V
9 granted patents·3 pending applications·1,021 citations·filing 2010–2015
88Inventor score
Top patents by PatentIndex Score
12 records- 0198US9412581B2Low-K dielectric gapfill by flowable depositionAPPLIED MATERIALS INC·Filed 2014·Granted Aug 9, 2016·396 cites·7 claims
- 0298US9362107B2Flowable low-k dielectric gapfill treatmentAPPLIED MATERIALS INC·Filed 2014·Granted Jun 7, 2016·430 cites·14 claims
- 0395US8475674B2High-temperature selective dry etch having reduced post-etch solid residueTHADANI KIRAN V·Filed 2010·Granted Jul 2, 2013·183 cites·12 claims
- 0488US8889566B2Low cost flowable dielectric filmsAPPLIED MATERIALS INC·Filed 2012·Granted Nov 18, 2014·9 cites·20 claims
- 0581US8921235B2Controlled air gap formationAPPLIED MATERIALS INC·Filed 2013·Granted Dec 30, 2014·2 cites·26 claims
- 0664US9583332B2Low temperature cure modulus enhancementAPPLIED MATERIALS INC·Filed 2015·Granted Feb 28, 2017·1 cites·19 claims
- 0759US2014091417A1Low refractive index coating deposited by remote plasma cvdAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 0855US9184093B2Integrated cluster to enable next generation interconnectAPPLIED MATERIALS INC·Filed 2014·Granted Nov 10, 2015·0 cites·18 claims
- 0951US9318383B2Integrated cluster to enable next generation interconnectAPPLIED MATERIALS INC·Filed 2015·Granted Apr 19, 2016·0 cites·17 claims
- 1045US2015196933A1Carbon dioxide and carbon monoxide mediated curing of low k films to increase hardness and modulusAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 1144US2015140833A1Method of depositing a low-temperature, no-damage hdp sic-like film with high wet etch resistanceAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 1237US9896326B2FCVD line bending resolution by deposition modulationAPPLIED MATERIALS INC·Filed 2015·Granted Feb 20, 2018·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →