Inventor · disambiguated record
Juan E. Dominguez
Also filed as: DOMINGUEZ JUAN · DOMINGUEZ JUAN E · DOMINGUEZ JUAN EDUARDO
28 granted patents·23 pending applications·223 citations·filing 2003–2020
96Inventor score
Top patents by PatentIndex Score
51 records- 0197US7964174B2Nanotube growth and device formationINTEL CORP·Filed 2008·Granted Jun 21, 2011·29 cites·11 claims
- 0295US7220671B2Organometallic precursors for the chemical phase deposition of metal films in interconnect applicationsINTEL CORP·Filed 2005·Granted May 22, 2007·66 cites·17 claims
- 0392US7635503B2Composite metal films and carbon nanotube fabricationINTEL CORP·Filed 2006·Granted Dec 22, 2009·16 cites·15 claims
- 0491US7682891B2Tunable gate electrode work function material for transistor applicationsINTEL CORP·Filed 2006·Granted Mar 23, 2010·19 cites·20 claims
- 0585US8319287B2Tunable gate electrode work function material for transistor applicationsLAVOIE ADRIEN R·Filed 2010·Granted Nov 27, 2012·7 cites·18 claims
- 0684US7354849B2Catalytically enhanced atomic layer deposition processINTEL CORP·Filed 2006·Granted Apr 8, 2008·13 cites·15 claims
- 0783US7687911B2Silicon-alloy based barrier layers for integrated circuit metal interconnectsINTEL CORP·Filed 2006·Granted Mar 30, 2010·8 cites·5 claims
- 0883US7459392B2Noble metal barrier and seed layer for semiconductorsINTEL CORP·Filed 2005·Granted Dec 2, 2008·12 cites·9 claims
- 0982US7851360B2Organometallic precursors for seed/barrier processes and methods thereofINTEL CORP·Filed 2007·Granted Dec 14, 2010·9 cites·30 claims
- 1081US11145632B2High density die package configuration on system boardsINTEL CORP·Filed 2017·Granted Oct 12, 2021·3 cites·20 claims
- 1179US8425987B2Surface charge enhanced atomic layer deposition of pure metallic filmsDOMINGUEZ JUAN E·Filed 2008·Granted Apr 23, 2013·5 cites·13 claims
- 1279US7964746B2Copper precursors for CVD/ALD/digital CVD of copper metal filmsADVANCED TECH MATERIALS·Filed 2008·Granted Jun 21, 2011·3 cites·14 claims
- 1378US7550385B2Amine-free deposition of metal-nitride filmsINTEL CORP·Filed 2005·Granted Jun 23, 2009·6 cites·10 claims
- 1477US7858525B2Fluorine-free precursors and methods for the deposition of conformal conductive films for nanointerconnect seed and fillINTEL CORP·Filed 2007·Granted Dec 28, 2010·5 cites·5 claims
- 1576US8222746B2Noble metal barrier layersLAVOIE ADRIEN R·Filed 2006·Granted Jul 17, 2012·5 cites·25 claims
- 1675US7749906B2Using unstable nitrides to form semiconductor structuresINTEL CORP·Filed 2006·Granted Jul 6, 2010·3 cites·17 claims
- 1772US7625817B2Method of fabricating a carbon nanotube interconnect structuresINTEL CORP·Filed 2005·Granted Dec 1, 2009·4 cites·2 claims
- 1870US7476615B2Deposition process for iodine-doped ruthenium barrier layersINTEL CORP·Filed 2006·Granted Jan 13, 2009·3 cites·45 claims
- 1969US2009209777A1Organometallic compounds, processes for the preparation thereof and methods of use thereofTHOMPSON DAVID M·Filed 2009·Application pending·0 cites
- 2068US10790257B2Active package substrate having anisotropic conductive layerINTEL CORP·Filed 2016·Granted Sep 29, 2020·1 cites·20 claims
- 2167US11694987B2Active package substrate having anisotropic conductive layerINTEL CORP·Filed 2020·Granted Jul 4, 2023·0 cites·22 claims
- 2263US7704895B2Deposition method for high-k dielectric materialsINTEL CORP·Filed 2008·Granted Apr 27, 2010·1 cites·10 claims
- 2362US2009200524A1Organometallic compounds, processes for the preparation thereof and methods of use thereofTHOMPSON DAVID M·Filed 2009·Application pending·0 cites
- 2454US8344352B2Using unstable nitrides to form semiconductor structuresINTEL CORP·Filed 2011·Granted Jan 1, 2013·0 cites·20 claims
- 2553US2010022083A1Carbon nanotube interconnect structuresINTEL CORP·Filed 2009·Application pending·0 cites
- 2652US7982204B2Using unstable nitrides to form semiconductor structuresINTEL CORP·Filed 2010·Granted Jul 19, 2011·0 cites·6 claims
- 2751US2007207611A1Noble metal precursors for copper barrier and seed layerLAVOIE ADRIEN R·Filed 2006·Application pending·0 cites
- 2849US2005147746A1Nanotube growth and device formationFiled 2003·Application pending·0 cites
- 2949US2008182021A1Continuous ultra-thin copper film formed using a low thermal budgetSIMKA HARSONO S·Filed 2007·Application pending·0 cites
- 3047US7435679B2Alloyed underlayer for microelectronic interconnectsINTEL CORP·Filed 2004·Granted Oct 14, 2008·2 cites·6 claims
- 3146US11817438B2System in package with interconnected modulesINTEL CORP·Filed 2019·Granted Nov 14, 2023·0 cites·20 claims
- 3246US10497669B2Hybrid die stackingINTEL CORP·Filed 2016·Granted Dec 3, 2019·0 cites·19 claims
- 3345US2008223287A1Plasma enhanced ALD process for copper alloy seed layersLAVOIE ADRIEN R·Filed 2007·Application pending·0 cites
- 3445US2009022958A1Amorphous metal-metalloid alloy barrier layer for ic devicesPLOMBON JOHN J·Filed 2007·Application pending·0 cites
- 3543US7507521B2Silicon based optically degraded arc for lithographic patterningINTEL CORP·Filed 2004·Granted Mar 24, 2009·2 cites·15 claims
- 3643US2009166181A1Sputter deposition of metal alloy targets containing a high vapor pressure componentJEZEWSKI CHRISTOPHER J·Filed 2007·Application pending·0 cites
- 3743US2008096381A1Atomic layer deposition process for iridium barrier layersHAN JOSEPH H·Filed 2006·Application pending·0 cites
- 3842US2007264816A1Copper alloy layer for integrated circuit interconnectsLAVOIE ADRIEN R·Filed 2006·Application pending·0 cites
- 3942US2007281476A1Methods for forming thin copper films and structures formed therebyLAVOIE ADRIEN R·Filed 2006·Application pending·0 cites
- 4040US2008045013A1Iridium encased metal interconnects for integrated circuit applicationsLAVOIE ADRIEN R·Filed 2006·Application pending·0 cites
- 4139US2006090692A1Generating nano-particles for chemical mechanical planarizationDOMINGUEZ JUAN E·Filed 2004·Application pending·0 cites
- 4238US2010098960A1Magnetic insulator nanolaminate device for integrated silicon voltage regulatorsDOMINGUEZ JUAN E·Filed 2007·Application pending·0 cites
- 4337US2020075446A1Electronic device packageINTEL CORP·Filed 2016·Application pending·0 cites
- 4437US2019181093A1Active package substrate having embedded interposerINTEL CORP·Filed 2016·Application pending·0 cites
- 4537US2006281306A1Carbon nanotube interconnect contactsGSTREIN FLORIAN·Filed 2005·Application pending·0 cites
- 4636US2018041003A1Chip on chip (coc) package with interposerINTEL CORP·Filed 2016·Application pending·0 cites
- 4736US2019229093A1Electronic device packageINTEL CORP·Filed 2016·Application pending·0 cites
- 4835US2006147845A1Electrically reconfigurable photolithography mask for semiconductor and micromechanical substratesFLANIGAN KYLE Y·Filed 2005·Application pending·0 cites
- 4935US2006286800A1Method for adhesion and deposition of metal films which provide a barrier and permit direct platingDOMINGUEZ JUAN E·Filed 2005·Application pending·0 cites
- 5033US2018190776A1Semiconductor chip package with cavityGOGINENI SIREESHA·Filed 2016·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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