Carbon nanotube interconnect structures

Abstract

A method including forming an interconnect of single-walled carbon nanotubes on a sacrificial substrate; transferring the interconnect from the sacrificial substrate to a circuit substrate; and coupling the interconnect to a contact point on the circuit substrate. A method including forming a nanotube bundle on a circuit substrate between a first contact point and a second contact point, the nanotube defining a lumen therethrough; filling a portion of a length of the lumen of the nanotube bundle with an electrically conductive material; and coupling the electrically conductive material to the second contact point. A system including a computing device comprising a microprocessor, the microprocessor coupled to a printed circuit board, the microprocessor including a substrate having a plurality of circuit devices with electrical connections made to the plurality of circuit devices through interconnect structures including carbon nanotube bundles.

1 . A method comprising:
 forming a carbon nanotube bundle on a circuit substrate between a first contact point and a second contact point, the nanotube bundle defining a lumen therethrough;   filling a portion of a length of the lumen of the nanotube bundle with an electrically conductive material; and   coupling the electrically conductive material to the second contact point.   
   
   
       2 . The method of  claim 1 , wherein the electrically conductive material comprises a refractory metal, and filling a portion of the nanotube comprises filling by way of one of an electroless process, an atomic layer deposition process, and a chemical vapor deposition process. 
   
   
       3 . The method of  claim 2 , wherein prior to filling a portion of the length of the lumen, the method further comprising:
 coating an exterior surface of the nanotube with a barrier material having a property that will inhibit deposition of the electrically conductive material.