Individual holder
LAVOIE ADRIEN R
US·6 granted patents·9 pending applications·49 citations·filing 2006–2010
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
15 records- 0195US8252680B2Methods and architectures for bottomless interconnect viasLAVOIE ADRIEN R·Filed 2010·Granted Aug 28, 2012·23 cites·11 claims
- 0285US8319287B2Tunable gate electrode work function material for transistor applicationsLAVOIE ADRIEN R·Filed 2010·Granted Nov 27, 2012·7 cites·18 claims
- 0379US7566661B2Electroless treatment of noble metal barrier and adhesion layerLAVOIE ADRIEN R·Filed 2006·Granted Jul 28, 2009·6 cites·5 claims
- 0476US8222746B2Noble metal barrier layersLAVOIE ADRIEN R·Filed 2006·Granted Jul 17, 2012·5 cites·25 claims
- 0572US8304909B2IC solder reflow method and materialsLAVOIE ADRIEN R·Filed 2007·Granted Nov 6, 2012·5 cites·13 claims
- 0666US8394694B2Reliability of high-K gate dielectric layersLAVOIE ADRIEN R·Filed 2007·Granted Mar 12, 2013·3 cites·12 claims
- 0751US2007207611A1Noble metal precursors for copper barrier and seed layerLAVOIE ADRIEN R·Filed 2006·Application pending·0 cites
- 0846US2009321934A1Self-aligned cap and barrierLAVOIE ADRIEN R·Filed 2008·Application pending·0 cites
- 0945US2008223287A1Plasma enhanced ALD process for copper alloy seed layersLAVOIE ADRIEN R·Filed 2007·Application pending·0 cites
- 1044US2010283570A1Nano-encapsulated magnetic particle composite layers for integrated silicon voltage regulatorsLAVOIE ADRIEN R·Filed 2007·Application pending·0 cites
- 1144US2008132050A1Deposition process for graded cobalt barrier layersLAVOIE ADRIEN R·Filed 2006·Application pending·0 cites
- 1243US2008160204A1Spontaneous copper seed deposition process for metal interconnectsLAVOIE ADRIEN R·Filed 2006·Application pending·0 cites
- 1342US2007264816A1Copper alloy layer for integrated circuit interconnectsLAVOIE ADRIEN R·Filed 2006·Application pending·0 cites
- 1442US2007281476A1Methods for forming thin copper films and structures formed therebyLAVOIE ADRIEN R·Filed 2006·Application pending·0 cites
- 1540US2008045013A1Iridium encased metal interconnects for integrated circuit applicationsLAVOIE ADRIEN R·Filed 2006·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →