Inventor · disambiguated record
Timothy C. Krywanczyk
Also filed as: KRYWANCZYK TIMOTHY · KRYWANCZYK TIMOTHY C · KRYWANCZYK TIMOTHY CHARLES
35 granted patents·4 pending applications·321 citations·filing 1996–2016
97Inventor score
Top patents by PatentIndex Score
39 records- 0192US7932614B2Method of thinning a semiconductor substrateIBM·Filed 2010·Granted Apr 26, 2011·12 cites·11 claims
- 0286US5842910AOff-center grooved polish pad for CMPIBM·Filed 1997·Granted Dec 1, 1998·72 cites·12 claims
- 0383US7867876B2Method of thinning a semiconductor substrateIBM·Filed 2008·Granted Jan 11, 2011·7 cites·18 claims
- 0483US5913125AMethod of controlling stress in a filmIBM·Filed 1996·Granted Jun 15, 1999·68 cites·2 claims
- 0573US7722446B2System and device for thinning wafers that have contact bumpsIBM·Filed 2006·Granted May 25, 2010·3 cites·12 claims
- 0670US7498236B2Silicon wafer thinning end point methodIBM·Filed 2006·Granted Mar 3, 2009·3 cites·3 claims
- 0770US6599173B1Method to prevent leaving residual metal in CMP process of metal interconnectIBM·Filed 2000·Granted Jul 29, 2003·14 cites·22 claims
- 0868US7348216B2Rework process for removing residual UV adhesive from C4 wafer surfacesIBM·Filed 2005·Granted Mar 25, 2008·3 cites·10 claims
- 0968US6888223B2Use of photoresist in substrate vias during backside grindIBM·Filed 2003·Granted May 3, 2005·14 cites·32 claims
- 1067US7025891B2Method of polishing C4 molybdenum masks to remove molybdenum peaksIBM·Filed 2003·Granted Apr 11, 2006·13 cites·13 claims
- 1166US7700488B2Recycling of ion implantation monitor wafersIBM·Filed 2007·Granted Apr 20, 2010·2 cites·37 claims
- 1264US7771560B2Methods to prevent ECC (edge chipping and cracking) damage during die picking processIBM·Filed 2007·Granted Aug 10, 2010·2 cites·18 claims
- 1363US7387911B2Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and crackingIBM·Filed 2004·Granted Jun 17, 2008·10 cites·14 claims
- 1462US7732303B2Method for recycling of ion implantation monitor wafersIBM·Filed 2008·Granted Jun 8, 2010·1 cites·25 claims
- 1562US6294105B1Chemical mechanical polishing slurry and method for polishing metal/oxide layersIBM·Filed 1997·Granted Sep 25, 2001·22 cites·7 claims
- 1661US7572739B2Tape removal in semiconductor structure fabricationIBM·Filed 2005·Granted Aug 11, 2009·2 cites·12 claims
- 1761US7135124B2Method for thinning wafers that have contact bumpsIBM·Filed 2003·Granted Nov 14, 2006·6 cites·4 claims
- 1859US7844099B2Inspection method for protecting image sensor devices with front surface protectionIBM·Filed 2006·Granted Nov 30, 2010·1 cites·6 claims
- 1959US6355565B2Chemical-mechanical-polishing slurry and method for polishing metal/oxide layersIBM·Filed 2001·Granted Mar 12, 2002·5 cites·8 claims
- 2058US6340601B1Method for reworking copper metallurgy in semiconductor devicesIBM·Filed 1999·Granted Jan 22, 2002·26 cites·16 claims
- 2157US7288465B2Semiconductor wafer front side protectionIBM·Filed 2005·Granted Oct 30, 2007·1 cites·9 claims
- 2252US7987591B2Method of forming silicon chicklet pedestalIBM·Filed 2009·Granted Aug 2, 2011·1 cites·11 claims
- 2352US7074715B2Use of photoresist in substrate vias during backside grindIBM·Filed 2004·Granted Jul 11, 2006·5 cites·32 claims
- 2451US8806740B2Silicon chicklet pedestalCHEY S JAY·Filed 2011·Granted Aug 19, 2014·0 cites·15 claims
- 2551US8595919B2Silicon chicklet pedestalCHEY S JAY·Filed 2011·Granted Dec 3, 2013·0 cites·10 claims
- 2648US2008099149A1Rework process for removing residual uv adhesive from c4 wafer surfacesIBM·Filed 2008·Application pending·0 cites
- 2747US7001827B2Semiconductor wafer front side protectionIBM·Filed 2003·Granted Feb 21, 2006·3 cites·7 claims
- 2847US2008064185A1Semiconductor wafer front side protectionIBM·Filed 2007·Application pending·0 cites
- 2946US6284151B1Chemical mechanical polishing slurry for tungstenIBM·Filed 1997·Granted Sep 4, 2001·11 cites·5 claims
- 3045US8034718B2Method to recover patterned semiconductor wafers for reworkIBM·Filed 2008·Granted Oct 11, 2011·0 cites·20 claims
- 3145US6328794B1Method of controlling stress in a filmIBM·Filed 1997·Granted Dec 11, 2001·11 cites·38 claims
- 3244US10192748B2Controlling of etch depth in deep via etching processes and resultant structuresGLOBALFOUNDRIES INC·Filed 2016·Granted Jan 29, 2019·0 cites·19 claims
- 3344US7902682B2Ultraviolet energy curable tape and method of making a semiconductor chip using the tapeIBM·Filed 2003·Granted Mar 8, 2011·1 cites·22 claims
- 3444US2008113456A1Process for protecting image sensor wafers from front surface damage and contaminationIBM·Filed 2006·Application pending·0 cites
- 3543US6455434B1Prevention of slurry build-up within wafer topography during polishingIBM·Filed 2001·Granted Sep 24, 2002·2 cites·10 claims
- 3642US7666689B2Method to remove circuit patterns from a waferIBM·Filed 2006·Granted Feb 23, 2010·0 cites·4 claims
- 3740US8163602B2Ultraviolet energy curable tape and method of making a semiconductor chip using the tapeKRYWANCZYK TIMOTHY C·Filed 2011·Granted Apr 24, 2012·0 cites·9 claims
- 3835US7855130B2Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operationsIBM·Filed 2003·Granted Dec 21, 2010·0 cites·12 claims
- 3934US2007054115A1Method for cleaning particulate foreign matter from the surfaces of semiconductor wafersIBM·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →