Inventor · disambiguated record
Nazir Ahmad
Also filed as: AHMAD NAZIR · AHMAD NAZIR HAROON
15 granted patents·7 pending applications·408 citations·filing 1994–2019
94Inventor score
Files withCHIPPAC INC6AHMAD NAZIR4Chu Quyen Duc2PINNACLE RESEARCH INST INC2APOLLO PREC KUNMING YUANHONG LIMITED1
Top patents by PatentIndex Score
22 records- 0195US5867363AEnergy storage devicePINNACLE RESEARCH INST INC·Filed 1994·Granted Feb 2, 1999·155 cites·26 claims
- 0291US9112080B1Electrical connectors of building integrable photovoltaic modulesCORNEILLE JASON S·Filed 2011·Granted Aug 18, 2015·13 cites·20 claims
- 0391US6940178B2Self-coplanarity bumping shape for flip chipCHIPPAC INC·Filed 2002·Granted Sep 6, 2005·51 cites·13 claims
- 0486US5800857AEnergy storage device and methods of manufacturePINNACLE RESEARCH INST INC·Filed 1995·Granted Sep 1, 1998·97 cites·25 claims
- 0584US6737295B2Chip scale package with flip chip interconnectCHIPPAC INC·Filed 2002·Granted May 18, 2004·34 cites·14 claims
- 0679US9626754B2System, apparatus and method for dispensed adhesive material inspectionChu Quyen Duc·Filed 2015·Granted Apr 18, 2017·4 cites·29 claims
- 0779US7407877B2Self-coplanarity bumping shape for flip-chipCHIPPAC INC·Filed 2005·Granted Aug 5, 2008·7 cites·20 claims
- 0877US10769775B2System, apparatus and method for dispensed adhesive material inspectionJABIL INC·Filed 2019·Granted Sep 8, 2020·2 cites·17 claims
- 0977US10204408B2System, apparatus and method for dispensed adhesive material inspectionChu Quyen Duc·Filed 2017·Granted Feb 12, 2019·3 cites·18 claims
- 1065US9935225B2Electrical connectors of building integrable photovoltaic modulesAPOLLO PREC KUNMING YUANHONG LIMITED·Filed 2015·Granted Apr 3, 2018·1 cites·8 claims
- 1165US8119450B2Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spotsAHMAD NAZIR·Filed 2009·Granted Feb 21, 2012·2 cites·18 claims
- 1265US7211901B2Self-coplanarity bumping shape for flip chipCHIPPAC INC·Filed 2005·Granted May 1, 2007·2 cites·9 claims
- 1362US2018323322A1Electrical connectors of building integrable photovoltaic modulesMIASOLE HI TECH CORP·Filed 2018·Application pending·0 cites
- 1461US6514296B1Method of making energy storage device having electrodes coated with insulating microprotrusionsPACIFIC SHINFU TECHNOLOGIES CO·Filed 1998·Granted Feb 4, 2003·32 cites·20 claims
- 1558US2014261635A1Electrical terminations for flexible photovoltaic modulesNG ERIC·Filed 2013·Application pending·0 cites
- 1656US7107487B2Fault tolerant sleep mode of operationLENOVO SINGAPORE PTE LTD·Filed 2002·Granted Sep 12, 2006·5 cites·20 claims
- 1751US2006255474A1Packaging structure and methodCHIPPAC INC·Filed 2006·Application pending·0 cites
- 1850US9312150B2Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip packageAHMAD NAZIR·Filed 2011·Granted Apr 12, 2016·0 cites·15 claims
- 1949US2012217635A9Packaging Structure and MethodAHMAD NAZIR·Filed 2011·Application pending·0 cites
- 2041US2004222440A1Chip scale package with flip chip interconnectCHIPPAC INC·Filed 2004·Application pending·0 cites
- 2139US2002014702A1Packaging structure and methodFiled 2001·Application pending·0 cites
- 2235US2008277747A1MEMS device support structure for sensor packagingAHMAD NAZIR·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →