Inventor · disambiguated record
Norman J. Armendariz
Also filed as: ARMENDARIZ NORMAN · ARMENDARIZ NORMAN J
7 granted patents·1 pending application·276 citations·filing 1996–2017
86Inventor score
Top patents by PatentIndex Score
8 records- 0194US5828226AProbe card assembly for high density integrated circuitsCERPROBE CORP·Filed 1996·Granted Oct 27, 1998·231 cites·11 claims
- 0293US8344749B2Through carrier dual side loop-back testing of TSV die after die attach to substrateTEXAS INSTRUMENTS INC·Filed 2010·Granted Jan 1, 2013·23 cites·22 claims
- 0378US8471577B2Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrateSTILLMAN DANIEL JOSEPH·Filed 2010·Granted Jun 25, 2013·8 cites·23 claims
- 0472US10276282B2Coaxial transmission line structureRAYTHEON CO·Filed 2017·Granted Apr 30, 2019·1 cites·21 claims
- 0559US6875367B2Attaching components to a printed circuit cardINTEL CORP·Filed 2003·Granted Apr 5, 2005·6 cites·16 claims
- 0657US6818155B2Attaching components to a printed circuit cardINTEL CORP·Filed 2002·Granted Nov 16, 2004·5 cites·13 claims
- 0748US6878305B2Attaching components to a printed circuit cardINTEL CORP·Filed 2003·Granted Apr 12, 2005·2 cites·29 claims
- 0837US2013271172A1Probe apparatus and methodARMENDARIZ NORMAN J·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →