Inventor · disambiguated record
Zhongyu Luan
Also filed as: LUAN ZHONGYU
34 granted patents·4 pending applications·34 citations·filing 2016–2025
95Inventor score
Files withNINGBO SUNNY OPOTECH CO LTD38
Top patents by PatentIndex Score
38 records- 0197US9826132B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Nov 21, 2017·14 cites·24 claims
- 0294US9906700B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Feb 27, 2018·6 cites·30 claims
- 0393US9781325B1Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Oct 3, 2017·5 cites·20 claims
- 0491US11729483B2Photosensitive component, and camera module and manufacturing method thereforNINGBO SUNNY OPOTECH CO LTD·Filed 2022·Granted Aug 15, 2023·1 cites·12 claims
- 0588US10578837B2Molded photosensitive assembly for array imaging module for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Mar 3, 2020·1 cites·8 claims
- 0685US10321028B2Photosensitive assembly and camera module and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jun 11, 2019·3 cites·31 claims
- 0782US12119361B2Circuit board assembly with photosensitive element mounted to back side of circuit boardNINGBO SUNNY OPOTECH CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 0881US12298533B2Manufacturing method of a molded photosensitive assembly for an array imaging moduleNINGBO SUNNY OPOTECH CO LTD·Filed 2022·Granted May 13, 2025·0 cites·15 claims
- 0979US10126519B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Nov 13, 2018·1 cites·24 claims
- 1076US11822099B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Nov 21, 2023·0 cites·11 claims
- 1175US2025301815A1Circuit board assembly, photosensitive assembly, camera module, and preparation methods for circuit board assembly and photosensitive assemblyNINGBO SUNNY OPOTECH CO LTD·Filed 2025·Application pending·0 cites
- 1274US11721709B2Circuit board assembly with photosensitive element mounted to back side of circuit boardNINGBO SUNNY OPOTECH CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·18 claims
- 1374US2020218034A1Molded Photosensitive Assembly for Array Imaging Module for Electronic Device and Manufacturing Method ThereofNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Application pending·0 cites
- 1472US12081849B2Photosensitive assembly, camera module and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Sep 3, 2024·1 cites·18 claims
- 1571US11049898B2Systems and methods for manufacturing semiconductor modulesNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jun 29, 2021·1 cites·17 claims
- 1668US12021097B2Camera module, and photosensitive component thereof and manufacturing method thereforNINGBO SUNNY OPOTECH CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·6 claims
- 1767US11289521B2Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2016·Granted Mar 29, 2022·1 cites·20 claims
- 1866US11652132B2Systems and methods for manufacturing semiconductor modulesNINGBO SUNNY OPOTECH CO LTD·Filed 2021·Granted May 16, 2023·0 cites·18 claims
- 1966US11627239B2Photosensitive assembly and camera module and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 2065US11824071B2Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 2163US10908324B2Molded photosensitive assembly of array imaging moduleNINGBO SUNNY OPOTECH CO LTD·Filed 2016·Granted Feb 2, 2021·0 cites·5 claims
- 2263US10274694B2Manufacturing method of a molded photosensitive assembly of an array imaging moduleNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·23 claims
- 2363US10175447B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jan 8, 2019·0 cites·24 claims
- 2462US10582097B2Photosensitive assembly and camera module and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2019·Granted Mar 3, 2020·0 cites·23 claims
- 2562US10033913B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jul 24, 2018·0 cites·4 claims
- 2660US12408465B2Circuit board assembly, photosensitive assembly, camera module, and preparation methods for circuit board assembly and photosensitive assemblyNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Sep 2, 2025·0 cites·18 claims
- 2759US11233079B2Camera module and molded circuit board assembly thereof, array camera module and electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2018·Granted Jan 25, 2022·0 cites·20 claims
- 2856US11388320B2Photosensitive component, and camera module and manufacturing method thereforNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Jul 12, 2022·0 cites·18 claims
- 2954US12211864B2Camera module, and photosensitive assembly and manufacturing method thereforNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Jan 28, 2025·0 cites·19 claims
- 3054US11906879B2Camera module, molded photosensitive assembly and manufacturing method thereof, and electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Feb 20, 2024·0 cites·20 claims
- 3154US2021203818A1Camera module, molding photosensitive assembly thereof, manufacturing method and electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2021·Application pending·0 cites
- 3253US10979610B2Camera module, molding photosensitive assembly thereof, manufacturing method and electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2018·Granted Apr 13, 2021·0 cites·18 claims
- 3351US12389524B2Molded circuit board and camera module, and manufacturing method thereof and electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Aug 12, 2025·0 cites·6 claims
- 3448US12364039B2Photosensitive assembly, camera module and manufacturing methods thereforNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Jul 15, 2025·0 cites·14 claims
- 3548US2019148429A1Camera module, and photosensitive component thereof and manufacturing method thereforNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Application pending·0 cites
- 3641US11223751B2Photosensitive assembly and camera module and manufacturing method thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Jan 11, 2022·0 cites·8 claims
- 3739US10148859B2Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Dec 4, 2018·0 cites·21 claims
- 3836US11871100B2Camera module and blocking-type photosensitive assembly, manufacturing method thereof, and electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Jan 9, 2024·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →