Camera module, molding photosensitive assembly thereof, manufacturing method and electronic device

Abstract

the present invention provides a camera module, a molding photosensitive assembly thereof, a manufacturing method, and an electronic device, the molding photosensitive assembly comprises a lens, a photosensitive element, a circuit board, a molding base, and a supporting element, the photosensitive element being arranged on the circuit board, the molding base being formed into an integral structure with the lens, the supporting element, the photosensitive element, and the circuit board by means of a molding process, and the camera module and the molding photosensitive assembly thereof being capable of reducing stain sensitivity and shortening the distance of the lens plane above a light through hole of the lens to the photosensitive plane of the photosensitive element.

1 - 76 . (canceled) 
     
     
         77 . A molding photosensitive assembly applied to a camera module, comprising:
 a lens;   a photosensitive element;   a circuit board; and   a molding base;   wherein the molding base is formed into an integral structure with the lens, the photosensitive element and the circuit board by a molding process.   
     
     
         78 . The molding photosensitive assembly according to  claim 77 , wherein the lens includes a lens body and a lens periphery extending from the lens body, and the lens periphery of the lens has a top surface, a bottom surface and an outer peripheral surface, and both ends of the outer peripheral surface of the lens periphery extend respectively to connect to the top surface and the bottom surface of the lens periphery. 
     
     
         79 . The molding photosensitive assembly according to  claim 78 , wherein the lens is directly attached to a non-photosensitive area of the photosensitive element. 
     
     
         80 . The molding photosensitive assembly according to  claim 79 , wherein the lens periphery of the lens is directly attached to a non-photosensitive area of the photosensitive element. 
     
     
         81 . The molding photosensitive assembly according to  claim 79 , wherein the molding base is integrally molded to embed electronic component, an edge area of the circuit board, a chip outer side portion and a chip connection portion of the non-photosensitive area of the photosensitive element, and an outer peripheral surface of the lens periphery of the lens. 
     
     
         82 . The molding photosensitive assembly according to  claim 81 , wherein the molding base is integrally molded to embed a part or all of the top surface of the lens periphery. 
     
     
         83 . The molding photosensitive assembly according to  claim 81 , wherein an outer side of the lens is a square stepped shape. 
     
     
         84 . The molding photosensitive assembly according to  claim 77 , further includes a supporting element. 
     
     
         85 . The molding photosensitive assembly according to  claim 84 , wherein the photosensitive element and the circuit board are connected by at least one set of leads, the supporting element embeds entire of the lead, and the molding base embeds at least a part of the supporting element. 
     
     
         86 . The molding photosensitive assembly according to  claim 84 , wherein the photosensitive element and the circuit board are connected by at least one set of leads, the supporting element embeds at least a part of the lead, and the molding base embeds at least a part of the supporting element and at least a part of the lead. 
     
     
         87 . The molding photosensitive assembly according to  claim 84 , wherein the supporting element includes a frame-shaped supporting main body and has a through hole, a photosensitive area of the photosensitive element corresponds to the through hole, the supporting main body has a top surface, an inner side surface and an outer side surface, the top surface of the supporting main body extends inwardly and outwardly to connect to the inner side surface and the outer side surface, and the inner side surface forms the through hole. 
     
     
         88 . The molding photosensitive assembly according to  claim 87 , wherein the lens includes a lens body and a lens periphery extending from the lens body, and the lens periphery of the lens has a top surface, a bottom surface and an outer peripheral surface, and both ends of the outer peripheral surface of the lens periphery extend respectively to connect to the top surface and the bottom surface of the lens periphery, and the bottom surface of the lens periphery is attached to the top surface of the supporting main body. 
     
     
         89 . The molding photosensitive assembly according to  claim 88 , wherein the molding base includes a molding body and has a molding hole, and the molding body embeds at least a part of the lens periphery of the lens, at least a part of the circuit board and the the outer surface of the supporting main body, and the photosensitive area of the photosensitive element and the position of the lens body of the lens correspond to the molding hole. 
     
     
         90 . The molding photosensitive assembly according to  claim 89 , wherein the molding base further includes a camera lens mounting section, the camera lens mounting section is integrally molded to be connected with the molding body. 
     
     
         91 . The molding photosensitive assembly according to  claim 89 , wherein the molding body further embeds at least a part of the top surface of the lens periphery. 
     
     
         92 . A camera module with a molding photosensitive assembly, comprising: the molding photosensitive assembly according  claim 77  and a camera lens, wherein light is converged to the photosensitive element after being refracted by the camera lens and the lens. 
     
     
         93 . The camera module with a molding photosensitive assembly according to  claim 92 , wherein the camera lens further includes a filter element, and the filter element is disposed in the camera lens. 
     
     
         94 . The camera module with a molding photosensitive assembly according to  claim 92 , further including a filter element, and the filter element is disposed between the camera lens and the photosensitive element of the molding photosensitive assembly. 
     
     
         95 . The camera module with a molding photosensitive assembly according to  claim 92 , wherein the molding photosensitive assembly further includes a filter element, the filter element being located at a position corresponding to a photosensitive area of the photosensitive element, and the filter element is attached to the photosensitive area of the photosensitive element. 
     
     
         96 . An electronic device, comprising one or more camera modules with molding photosensitive assembly according to  claim 92 , wherein each of the camera modules is for acquiring an image.