Camera module, and photosensitive component thereof and manufacturing method therefor

Abstract

A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.

1 - 128 . (canceled) 
     
     
         129 . A photosensitive unit of a camera module, comprising:
 an encapsulation portion; and   a photosensitive portion, including a main circuit board and a photosensitive sensor, wherein said encapsulation portion is encapsulated to form on said main circuit board and said photosensitive sensor and has a window defined by an inclined inner wall of said encapsulation portion and positioned above said photosensitive sensor to provide a light path of said photosensitive sensor.   
     
     
         130 . The photosensitive unit, as recited in  claim 129 , wherein said window is a concave shaped window which is defined by said inclined inner wall of said encapsulation portion. 
     
     
         131 . The photosensitive unit, as recited in  claim 130 , wherein said window of said encapsulation portion enlarges a size thereof from a bottom thereof upwardly and gradually, having a smaller bottom size and a larger top size, to form an inclined shape slope side. 
     
     
         132 . The photosensitive unit, as recited in  claim 129 , further comprising a connecting medium, wherein said photosensitive sensor is attached on said main circuit board through said connecting medium, said photosensitive sensor has a front side facing toward outside and a back side facing toward said main circuit board, wherein said connecting medium is deployed between said back side of said photosensitive sensor and said main circuit board to affix said photosensitive sensor on said main circuit board. 
     
     
         133 . The photosensitive unit, as recited in  claim 132 , wherein said photosensitive portion comprises at least one connecting element which electrically connects said photosensitive sensor and said main circuit board, wherein said photosensitive portion encapsulates and wraps up said connecting element. 
     
     
         134 . The photosensitive unit, as recited in  claim 133 , wherein said photosensitive portion comprises an optical filter positioned above said photosensitive sensor, wherein said encapsulation portion is molded to form on said main circuit board, said photosensitive sensor, and said optical filter. 
     
     
         135 . The photosensitive unit, as recited in  claim 133 , wherein said photosensitive portion comprises a reinforced layer, overlappedly attached to the bottom of said main circuit board, so as to reinforce the structural strength of said main circuit board. 
     
     
         136 . The photosensitive unit, as recited in  claim 135 , wherein said reinforced layer is a metal plate, so as to enhance the heat dissipation of said photosensitive portion. 
     
     
         137 . The photosensitive unit, as recited in  claim 133 , wherein said photosensitive portion comprises a shielding layer, covering, encapsulating, and wrapping up said main circuit board and at least a side of said encapsulation portion, so as to enhance the electromagnetic immunity of the photosensitive unit. 
     
     
         138 . A camera module, comprising:
 at least a circuit board;   at least a camera lens;   at least a protection frame;   at least a photosensitive sensor, comprising a photosensitive area and a non-photosensitive area both provided thereon, wherein said protection frame is protrudingly arranged on the periphery of said photosensitive area of said photosensitive sensor.   at least an integrally encapsulated frame, arranged to cover and wrap up said circuit board and said non-photosensitive area of said photosensitive sensor, so as to integrate said integrally encapsulated frame, said circuit board, and said photosensitive sensor, wherein said camera lens is deployed along a photosensitive path of said photosensitive sensor, wherein said photosensitive sensor and said circuit board are connected and communicated with each other.   
     
     
         139 . The camera module, as recited in  claim 138 , wherein a size of an inner side edge of said protection frame is equal to or larger than a size of the photosensitive area of said photosensitive sensor, wherein a size of an outer side edge of said protection frame is equal to or smaller than a size of said photosensitive sensor. 
     
     
         140 . The camera module, as recited in  claim 138 , further comprising a gluing layer, arranged between a periphery of said photosensitive area of said photosensitive sensor and said protection frame, so as to connect said protection frame and said periphery of said photosensitive area of said photosensitive sensor through said gluing layer. 
     
     
         141 . The camera module, as recited in  claim 138 , further comprising a camera lens support, arranged on said integrally encapsulated frame, wherein said camera lens is arranged on said camera lens support. 
     
     
         142 . The camera module, as recited in  claim 141 , wherein said camera lens support and said integrally encapsulated frame are integrally formed. 
     
     
         143 . The camera module, as recited in  claim 141 , wherein said camera lens support is a motor unit, which is communicated and connected with said circuit board. 
     
     
         144 . The camera module, as recited in  claim 141 , further comprising a filter which arranged on top of said integrally encapsulated frame and positioned between said photosensitive sensor and said camera lens. 
     
     
         145 . A manufacturing method for a photosensitive unit, comprising the steps of:
 (A) attaching a connecting medium in a semi-solid state on the back side of a photosensitive sensor;   (B) attaching said photosensitive sensor on a main circuit board through said connecting medium;   (C) solidifying said connecting medium, so as to flat and stably connect said photosensitive sensor and said main circuit board; and   (D) deploying at least a connecting element on said photosensitive sensor and said main circuit board to electrically connect said photosensitive sensor and said main circuit board.   
     
     
         146 . The manufacturing method, as recited in  claim 145 , wherein the step (A) comprises the steps of:
 attaching said connecting medium on a back side of a wafer;   attaching a dicing tape on an outer side of said connecting medium;   semi-solidifying said connecting medium; and   dicing said wafer, so as to obtain said photosensitive sensor carrying said semi-solidified connecting medium.   
     
     
         147 . The manufacturing method, as recited in  claim 145 , wherein the step (A) comprises the steps of:
 attaching said connecting medium on a back side of a wafer;   attaching a dicing tape on a front side of said wafer;   semi-solidifying said connecting medium; and   dicing said wafer, so as to obtain said photosensitive sensor carrying said semi-solidified connecting medium.   
     
     
         148 . The manufacturing method, as recited in  claim 145 , wherein the step (A) comprises the steps of:
 attaching said connecting medium on a dicing tape;   semi-solidifying said connecting medium;   attaching said connecting medium on a wafer; and   dicing said wafer, so as to obtain said photosensitive sensor carrying said semi-solidified connecting medium.