Inventor · disambiguated record
Ming-Tse Lin
Also filed as: LIN MING-TSE
38 granted patents·10 pending applications·228 citations·filing 2003–2023
97Inventor score
Top patents by PatentIndex Score
48 records- 0199US11482485B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 25, 2022·7 cites·14 claims
- 0299US9748167B1Silicon interposer, semiconductor package using the same, and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 29, 2017·56 cites·23 claims
- 0399US9478496B1Wafer to wafer structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 25, 2016·48 cites·9 claims
- 0496US11450633B2Package structure of semiconductor device with improved bonding between the substratesUNITED MICROELECTRONICS CORP·Filed 2020·Granted Sep 20, 2022·6 cites·10 claims
- 0595US11699646B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jul 11, 2023·2 cites·14 claims
- 0694US12068234B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2023·Granted Aug 20, 2024·1 cites·15 claims
- 0794US9035457B2Substrate with integrated passive devices and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2012·Granted May 19, 2015·21 cites·16 claims
- 0893US11164822B1Structure of semiconductor device and method for bonding two substratesUNITED MICROELECTRONICS CORP·Filed 2020·Granted Nov 2, 2021·3 cites·21 claims
- 0992US9123789B2Chip with through silicon via electrode and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 1, 2015·12 cites·8 claims
- 1089US12394169B2Optical sensor mechanism capable of mitigating signal nonlinearityPIXART IMAGING INC·Filed 2022·Granted Aug 19, 2025·1 cites·18 claims
- 1188US10325873B2Chip-stack structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jun 18, 2019·4 cites·14 claims
- 1286US10790248B2Three-dimensional integrated circuit and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 29, 2020·4 cites·18 claims
- 1386US9666507B2Through-substrate structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted May 30, 2017·7 cites·12 claims
- 1485US10153252B2Wafer to wafer structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 11, 2018·4 cites·13 claims
- 1585US7253599B2Bandgap reference circuitNVIDIA CORP·Filed 2006·Granted Aug 7, 2007·14 cites·7 claims
- 1682US9978666B2Method for fabrication semiconductor device with through-substrate viaUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 22, 2018·3 cites·7 claims
- 1781US9022392B2Chuck and semiconductor process using the sameJANG CHUNG-SUNG·Filed 2012·Granted May 5, 2015·7 cites·5 claims
- 1879US10340231B2Semiconductor package structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jul 2, 2019·2 cites·12 claims
- 1979US9123730B2Semiconductor device having through silicon trench shielding structure surrounding RF circuitUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 1, 2015·5 cites·19 claims
- 2076US8692359B2Through silicon via structure having protection ringLIN YUNG-CHANG·Filed 2011·Granted Apr 8, 2014·4 cites·8 claims
- 2172US10192808B1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 29, 2019·2 cites·17 claims
- 2272US8144047B2Current-mode dual-slope temperature-digital conversion deviceLIN MING-TSE·Filed 2010·Granted Mar 27, 2012·7 cites·10 claims
- 2369US12148723B2Structure of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Nov 19, 2024·0 cites·7 claims
- 2468US10886241B1Semiconductor package structureUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 5, 2021·0 cites·12 claims
- 2568US9024416B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 5, 2015·2 cites·17 claims
- 2667US8441134B2Chip stacking structureKUO CHIEN-LI·Filed 2011·Granted May 14, 2013·2 cites·10 claims
- 2765US2022384376A1Package structure of semiconductor device with improved bonding between the substratesUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 2864US11557558B2Structure of semiconductor device and method for bonding two substratesUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 17, 2023·0 cites·6 claims
- 2964US2021057368A1Chip-stack structureUNITED MICROELECTRONICS CORP·Filed 2020·Application pending·0 cites
- 3061US7619401B2Bandgap reference circuitNVIDIA CORP·Filed 2007·Granted Nov 17, 2009·4 cites·8 claims
- 3160US10818616B2Semiconductor package structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 27, 2020·0 cites·5 claims
- 3257US2019259725A1Manufacturing method of die-stack structureUNITED MICROELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 3353US11569188B2Semiconductor device including elongated bonding structure between the substrateUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 31, 2023·0 cites·18 claims
- 3451US9761509B2Semiconductor device with throgh-substrate via and method for fabrication the semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 12, 2017·0 cites·9 claims
- 3549US9437491B2Method of forming chip with through silicon via electrodeUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 6, 2016·0 cites·11 claims
- 3648US9412686B2Interposer structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2014·Granted Aug 9, 2016·0 cites·10 claims
- 3748US9287173B2Through silicon via and process thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Mar 15, 2016·0 cites·6 claims
- 3848US9111850B2Chuck and semiconductor process using the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 18, 2015·0 cites·12 claims
- 3948US9048223B2Package structure having silicon through vias connected to ground potentialUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jun 2, 2015·0 cites·16 claims
- 4047US9343359B2Integrated structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 17, 2016·0 cites·9 claims
- 4144US2015179580A1Hybrid interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 4243US2004197932A1Bio-vehicle, biosensor and biotransducer systemFiled 2003·Application pending·0 cites
- 4343US2015332996A1Interposer and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 4441US10504821B2Through-silicon via structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 10, 2019·0 cites·5 claims
- 4541US2020243386A1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 4641US2014113452A1Wafer edge trimming methodUNITED MICROELECTRONICS CORP·Filed 2012·Application pending·0 cites
- 4740US2013140688A1Through Silicon Via and Method of Manufacturing the SameCHEN CHUN-HUNG·Filed 2011·Application pending·0 cites
- 4839US2013015504A1Tsv structure and method for forming the sameKUO CHIEN-LI·Filed 2011·Application pending·0 cites
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