Inventor · disambiguated record
Young-Kwan Seo
Also filed as: SEO YOUNG KWAN
14 granted patents·18 pending applications·162 citations·filing 2006–2024
91Inventor score
Files withSAMSUNG ELECTRO MECH10INKTEC CO LTD6CHUNG KWANG-CHOON5KIM TAE HOON5SAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
32 records- 0197US8226755B2Organic silver complexes, their preparation methods and their methods for forming thin layersCHUNG KWANG-CHOON·Filed 2006·Granted Jul 24, 2012·38 cites·21 claims
- 0297US7691294B2Conductive inks and manufacturing method thereofINKTEC CO LTD·Filed 2006·Granted Apr 6, 2010·66 cites·27 claims
- 0396US7955528B2Conductive inks and manufacturing method thereofINKTEC CO LTD·Filed 2010·Granted Jun 7, 2011·24 cites·12 claims
- 0492US8679242B2Organic silver complexes, their preparation methods and their methods for forming thin layersCHUNG KWANG-CHOON·Filed 2012·Granted Mar 25, 2014·8 cites·21 claims
- 0588US8821753B2Etching SolutionsINKTEC CO LTD·Filed 2013·Granted Sep 2, 2014·5 cites·23 claims
- 0686US8445578B2Compositions for forming reflecting layer having organic silver complexes, and method for preparing reflecting layer using sameCHUNG KWANG-CHOON·Filed 2007·Granted May 21, 2013·7 cites·25 claims
- 0784US8366958B2Etching solutionsINKTEC CO LTD·Filed 2006·Granted Feb 5, 2013·8 cites·12 claims
- 0873US9733565B2Resin composition, printed circuit board using the composition, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Aug 15, 2017·2 cites·24 claims
- 0973US8900697B2Surface modified silica by alkyl sulfonated tetrazole compound, preparing method thereof, and resin composition containing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 2, 2014·3 cites·13 claims
- 1072US8389601B2Inkjet ink compositionKIM TAE-HOON·Filed 2009·Granted Mar 5, 2013·1 cites·4 claims
- 1166US9914743B2Organic silver complexes, their preparation methods and their methods for forming thin layersINKTEC CO LTD·Filed 2016·Granted Mar 13, 2018·0 cites·1 claims
- 1265US2014179944A1Organic Silver Complexes, Their Preparation Methods and Their Methods for Forming Thin LayersCHUNG KWANG-CHOON·Filed 2013·Application pending·0 cites
- 1362US9365935B2Etching solutionsINKTEC CO LTD·Filed 2014·Granted Jun 14, 2016·0 cites·14 claims
- 1461US2025140668A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1559US2024421020A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1656US12237253B2Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 1753US8211453B2Antibacterial composition containing organic silver complexes, antibacterial treatment methods using the same and antibacterial formed articleCHUNG KWANG-CHOON·Filed 2007·Granted Jul 3, 2012·0 cites·13 claims
- 1852US2011030999A1Metal circuit wiring having organic resin for adhesive layers and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1948US2011236646A1Ink composition, metal thin film prepared using the same and method of preparing the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2048US2013118787A1Epoxy resin composition for forming printed circuit board, printed circuit board manufactured therefrom, and method for manufacturing the printed circuit boardKIM TAE HOON·Filed 2012·Application pending·0 cites
- 2147US2011129607A1Substitutional electroless gold plating solution and method for forming gold plating layer using the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2246US2011318541A1Metal ink composition and method for forming the metal line using the same, and conductive pattern formed by using the metal ink compositionKIM TAE HOON·Filed 2010·Application pending·0 cites
- 2345US2013133926A1Build-up printed circuit board and method of manufacturing the sameKIM TAE HOON·Filed 2012·Application pending·0 cites
- 2444US2015050585A1Resin composition, printed circuit board using the composition, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2544US2014186593A1Resin composition for printed circuit board, insulating film, prepreg, and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2643US2014370297A1Conductive polymer composition and conductive film using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2742US2013157011A1Resin substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2842US2020135631A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 2942US2011315436A1Metal ink composition and method for forming the metal line using the same, and conductive pattern formed by using the metal ink compositionKIM TAE HOON·Filed 2010·Application pending·0 cites
- 3041US2013209760A1Alkyl sulfonated tetrazole compound, preparing method thereof, and epoxy resin containing the same, and substrate produced therefromSEO YOUNG KWAN·Filed 2012·Application pending·0 cites
- 3140US2020118985A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 3237US2011151117A1Organic metal complexes for forming metal thin layer, ink including the same and method for forming metal thin layer using the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →