Inventor · disambiguated record
Nancy C. Labianca
Also filed as: GORDON MICHAEL S · LABIANCA NANCY · LABIANCA NANCY C · LABIANCA NANCY CAROLYN
25 granted patents·5 pending applications·379 citations·filing 1987–2011
96Inventor score
Top patents by PatentIndex Score
30 records- 0198US7649257B2Discrete placement of radiation sources on integrated circuit devicesIBM·Filed 2008·Granted Jan 19, 2010·62 cites·21 claims
- 0295US7219713B2Heterogeneous thermal interface for coolingIBM·Filed 2005·Granted May 22, 2007·38 cites·37 claims
- 0392US7063127B2Method and apparatus for chip-coolingIBM·Filed 2003·Granted Jun 20, 2006·71 cites·27 claims
- 0488US6924171B2Bilayer wafer-level underfillIBM·Filed 2001·Granted Aug 2, 2005·51 cites·22 claims
- 0578US7776993B2Underfilling with acid-cleavable acetal and ketal epoxy oligomersIBM·Filed 2005·Granted Aug 17, 2010·8 cites·13 claims
- 0677US6919420B2Acid-cleavable acetal and ketal based epoxy oligomersIBM·Filed 2002·Granted Jul 19, 2005·21 cites·23 claims
- 0777US6617698B2Reworkable and thermally conductive adhesive and use thereofIBM·Filed 2001·Granted Sep 9, 2003·11 cites·8 claims
- 0876US8288177B2SER testing for an IC chip using hot underfillGAYNES MICHAEL·Filed 2010·Granted Oct 16, 2012·5 cites·20 claims
- 0975US7417315B2Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packagingIBM·Filed 2002·Granted Aug 26, 2008·12 cites·30 claims
- 1073US8241957B2Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packagingHOUGHAM GARETH GEOFFREY·Filed 2010·Granted Aug 14, 2012·2 cites·16 claims
- 1171US7238547B2Packaging integrated circuits for accelerated detection of transient particle induced soft error ratesIBM·Filed 2005·Granted Jul 3, 2007·5 cites·20 claims
- 1269US4806455AThermal stabilization of photoresist imagesMACDERMID INC·Filed 1987·Granted Feb 21, 1989·19 cites·5 claims
- 1367US5859655APhotoresist for use in ink jet printers and other micro-machining applicationsIBM·Filed 1996·Granted Jan 12, 1999·23 cites·11 claims
- 1466US7556979B2Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packagingIBM·Filed 2007·Granted Jul 7, 2009·1 cites·7 claims
- 1560US7883919B2Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packagingIBM·Filed 2009·Granted Feb 8, 2011·0 cites·6 claims
- 1659US7773220B2Method and system for collecting alignment data from coated chips or wafersIBM·Filed 2008·Granted Aug 10, 2010·1 cites·20 claims
- 1757US5879859AStrippable photoimageable compositionsIBM·Filed 1997·Granted Mar 9, 1999·23 cites·26 claims
- 1856US6777817B2Reworkable and thermally conductive adhesive and use thereofIBM·Filed 2003·Granted Aug 17, 2004·2 cites·15 claims
- 1950US5464927APolyamic acid and polyimide from fluorinated reactantIBM·Filed 1993·Granted Nov 7, 1995·6 cites·22 claims
- 2048US5780199APolyamic acid and polyimide from fluorinated reactantIBM·Filed 1995·Granted Jul 14, 1998·8 cites·26 claims
- 2147US7951648B2Chip-level underfill method of manufactureIBM·Filed 2008·Granted May 31, 2011·0 cites·19 claims
- 2245US8785217B2Tunable radiation sourceGAYNES MICHAEL A·Filed 2011·Granted Jul 22, 2014·0 cites·16 claims
- 2345US2009102070A1Alignment Marks on the Edge of Wafers and Methods for SameIBM·Filed 2007·Application pending·0 cites
- 2445US2009108472A1Wafer-level underfill process using over-bump-applied resinIBM·Filed 2007·Application pending·0 cites
- 2544US2008265445A1Marks for the Alignment of Wafer-Level Underfilled Silicon Chips and Method to Produce SameIBM·Filed 2007·Application pending·0 cites
- 2643US2008310808A1Photonic waveguide structure with planarized sidewall cladding layerIBM·Filed 2007·Application pending·0 cites
- 2740US2006131738A1Method and apparatus for chip cooling using a liquid metal thermal interfaceFURMAN BRUCE K·Filed 2005·Application pending·0 cites
- 2839US5858943AGel for localized removal of reworkable encapsulantIBM·Filed 1997·Granted Jan 12, 1999·6 cites·7 claims
- 2934US6013414APhotosensitive polyimide-precursor formulationIBM·Filed 1994·Granted Jan 11, 2000·2 cites·9 claims
- 3032US6010832APhotosensitive polyimide-precursor formulationIBM·Filed 1995·Granted Jan 4, 2000·2 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →