Assignee

GAYNES MICHAEL

US·2 granted patents·5 citations·filing 2008–2010

Technology mixC08L1 C09J1 G01R1 H05K1 H10P1 H10W1

Top patents by PatentIndex Score

2 records

0176US8288177B2SER testing for an IC chip using hot underfillGAYNES MICHAEL·Filed 2010·Granted Oct 16, 2012·5 cites·20 claims
0245US8293141B2Electronic device comprising electrically stable copper filled electrically conductive adhesiveGAYNES MICHAEL·Filed 2008·Granted Oct 23, 2012·0 cites·13 claims

Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →