Inventor · disambiguated record
Katsuhisa Sakai
Also filed as: SAKAI KATSUHISA
8 granted patents·2 pending applications·49 citations·filing 1988–2024
83Inventor score
Top patents by PatentIndex Score
10 records- 0176US4841017APolyether compounds, epoxy resins and processes for production thereofDAICEL CHEM·Filed 1988·Granted Jun 20, 1989·23 cites·7 claims
- 0258US2025285871A1Method of manufacturing semiconductor device and semiconductor device manufacturing apparatusMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0357US6872656B2Semiconductor device and method of fabricating the sameRENESAS TECH CORP·Filed 2003·Granted Mar 29, 2005·9 cites·5 claims
- 0453US6769960B2System for manufacturing a semiconductor device, polishing slurry feeder and method for manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Aug 3, 2004·5 cites·12 claims
- 0549US5140091ACompositions of polyether compounds, epoxy compounds and processes for production thereof based on 4-vinylcyclohexene-1-oxideDAICEL CHEM·Filed 1990·Granted Aug 18, 1992·7 cites·2 claims
- 0646US7465662B2Method of making semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Dec 16, 2008·0 cites·2 claims
- 0746US2009137114A1Method of making semiconductor deviceRENESAS TECH CORP·Filed 2008·Application pending·0 cites
- 0844US5122586ACompositions of polyether compounds, epoxy compounds and processes for production thereof based on 4-vinylcyclohexene-1-oxideDAICEL CHEM·Filed 1989·Granted Jun 16, 1992·5 cites·6 claims
- 0943US7301237B2Semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Nov 27, 2007·0 cites·2 claims
- 1036US6399497B2Semiconductor manufacturing process and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jun 4, 2002·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →