Inventor · disambiguated record
Edward Combs
Also filed as: COMBS EDWARD G
10 granted patents·5 pending applications·1,750 citations·filing 1993–2006
94Inventor score
Technology areasH10W
Top patents by PatentIndex Score
15 records- 0197US6724071B2Molded plastic package with heat sink and enhanced electrical performanceASAT LTD·Filed 2002·Granted Apr 20, 2004·180 cites·18 claims
- 0295US6285075B1Integrated circuit package with bonding planes on a ceramic ring using an adhesive assemblyASAT LTD·Filed 1998·Granted Sep 4, 2001·280 cites·19 claims
- 0394US6734552B2Enhanced thermal dissipation integrated circuit packageASAT LTD·Filed 2001·Granted May 11, 2004·241 cites·24 claims
- 0494US6552417B2Molded plastic package with heat sink and enhanced electrical performanceASAT LTD·Filed 2001·Granted Apr 22, 2003·113 cites·1 claims
- 0594US6326678B1Molded plastic package with heat sink and enhanced electrical performanceASAT LTD·Filed 1993·Granted Dec 4, 2001·305 cites·19 claims
- 0694US6284569B1Method of manufacturing a flexible integrated circuit package utilizing an integrated carrier ring/stiffenerASAT LTD·Filed 1999·Granted Sep 4, 2001·181 cites·11 claims
- 0794US5596231AHigh power dissipation plastic encapsulated package for integrated circuit dieASAT LTD·Filed 1994·Granted Jan 21, 1997·203 cites·18 claims
- 0892US6111324AIntegrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit packageASAT LTD·Filed 1998·Granted Aug 29, 2000·137 cites·9 claims
- 0987US7015072B2Method of manufacturing an enhanced thermal dissipation integrated circuit packageASAT LTD·Filed 2004·Granted Mar 21, 2006·54 cites·18 claims
- 1087US6790710B2Method of manufacturing an integrated circuit packageASAT LTD·Filed 2002·Granted Sep 14, 2004·56 cites·48 claims
- 1140US2004046241A1Method of manufacturing enhanced thermal dissipation integrated circuit packageFiled 2003·Application pending·0 cites
- 1239US2003178719A1Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit packageFiled 2002·Application pending·0 cites
- 1338US2006223237A1Method of manufacturing enhanced thermal dissipation integrated circuit packageCOMBS EDWARD G·Filed 2006·Application pending·0 cites
- 1435US2005077613A1Integrated circuit packageFiled 2003·Application pending·0 cites
- 1534US2001000924A1Molded plastic package with heat sink and enhanced electrical performanceFiled 2000·Application pending·0 cites
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