Inventor · disambiguated record
Mirko Vogt
Also filed as: VOGT MIRKO
41 granted patents·14 pending applications·126 citations·filing 1999–2023
96Inventor score
Files withINFINEON TECHNOLOGIES AG20INFINEON TECHNOLOGIES DRESDEN GMBH19QIMONDA AG5INFINEON TECH DRESDEN GMBH & CO KG4OFFENBERG DIRK2
Top patents by PatentIndex Score
55 records- 0195US9382111B2Micromechanical system and method for manufacturing a micromechanical systemINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2015·Granted Jul 5, 2016·13 cites·15 claims
- 0288US9330929B1Systems and methods for horizontal integration of acceleration sensor structuresINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2014·Granted May 3, 2016·8 cites·12 claims
- 0383US11422151B2Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical deviceINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 23, 2022·1 cites·21 claims
- 0483US10681777B2Light emitter devices, optical filter structures and methods for forming light emitter devices and optical filter structuresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 9, 2020·2 cites·19 claims
- 0578US10683203B2Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS processINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2018·Granted Jun 16, 2020·1 cites·18 claims
- 0676US12332271B2Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical deviceINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jun 17, 2025·0 cites·13 claims
- 0776US6245640B1Method for fabricating a semiconductor structureSIEMENS AG·Filed 1999·Granted Jun 12, 2001·57 cites·8 claims
- 0875US10870575B2Stressed decoupled micro-electro-mechanical system sensorINFINEON TECH DRESDEN GMBH & CO KG·Filed 2018·Granted Dec 22, 2020·2 cites·20 claims
- 0972US9376314B2Method for manufacturing a micromechanical systemINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2014·Granted Jun 28, 2016·2 cites·21 claims
- 1071US9546923B2Sensor structures, systems and methods with improved integration and optimized footprintINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2014·Granted Jan 17, 2017·3 cites·19 claims
- 1170US10684306B2Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical deviceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 16, 2020·1 cites·20 claims
- 1269US12137500B2Light emitter devices, optical filter structures and methods for forming light emitter devices and optical filter structuresINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 5, 2024·0 cites·20 claims
- 1369US9887355B2Emitter and method for manufacturing the sameINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Granted Feb 6, 2018·1 cites·22 claims
- 1469US7294553B2Plasma-enhanced chemical vapour deposition process for depositing silicon nitride or silicon oxynitride, process for producing one such layer arrangement, and layer arrangementINFINEON TECHNOLOGIES AG·Filed 2003·Granted Nov 13, 2007·12 cites·21 claims
- 1567US9107335B2Method for manufacturing an integrated circuit and an integrated circuitINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 11, 2015·2 cites·19 claims
- 1666US7205243B2Process for producing a mask on a substrateINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 17, 2007·2 cites·20 claims
- 1763US11078072B2Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS processINFINEON TECH DRESDEN GMBH & CO KG·Filed 2020·Granted Aug 3, 2021·0 cites·18 claims
- 1860US10544037B2Integrated semiconductor device and manufacturing methodINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2018·Granted Jan 28, 2020·0 cites·19 claims
- 1960US10290805B2Emitter and method for manufacturing the sameINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2018·Granted May 14, 2019·0 cites·20 claims
- 2059US10060816B2Sensor structures, systems and methods with improved integration and optimized footprintINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Granted Aug 28, 2018·0 cites·19 claims
- 2159US7538034B2Integrated circuit having a metal elementQIMONDA AG·Filed 2006·Granted May 26, 2009·1 cites·19 claims
- 2258US10347778B2Graded-index structure for optical systemsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jul 9, 2019·0 cites·20 claims
- 2357US9896329B2Integrated semiconductor device and manufacturing methodINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Granted Feb 20, 2018·0 cites·19 claims
- 2456US7368390B2Photolithographic patterning process using a carbon hard mask layer of diamond-like hardness produced by a plasma-enhanced deposition processINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 6, 2008·6 cites·10 claims
- 2556US2023332969A1Pressure Sensing DeviceINFINEON TECH DRESDEN GMBH & CO KG·Filed 2023·Application pending·0 cites
- 2654US11594654B2Method of generating a germanium structure and optical device comprising a germanium structureINFINEON TECHNOLOGIES AG·Filed 2021·Granted Feb 28, 2023·0 cites·16 claims
- 2754US10084101B2Graded-index structure for optical systemsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Sep 25, 2018·0 cites·21 claims
- 2854US9209778B2Microelectromechanical resonatorsINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2013·Granted Dec 8, 2015·0 cites·11 claims
- 2954US7018781B2Method for fabricating a contact hole plane in a memory moduleINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 28, 2006·9 cites·29 claims
- 3053US9136136B2Method and structure for creating cavities with extreme aspect ratiosINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2013·Granted Sep 15, 2015·0 cites·9 claims
- 3152US9663355B2Method and structure for creating cavities with extreme aspect ratiosINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2015·Granted May 30, 2017·0 cites·9 claims
- 3251US7105279B2Method for fabricating a patterned layer on a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2003·Granted Sep 12, 2006·3 cites·10 claims
- 3350US11393714B2Producing a buried cavity in a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 19, 2022·0 cites·14 claims
- 3450US10386255B2Pressure sensor device and manufacturing methodINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2017·Granted Aug 20, 2019·0 cites·26 claims
- 3550US9752943B2Sensor structures, systems and methods with improved integration and optimized footprintINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2014·Granted Sep 5, 2017·0 cites·19 claims
- 3650US9641153B2Method of forming a resonatorINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2015·Granted May 2, 2017·0 cites·19 claims
- 3747US2016185594A1Systems and methods for horizontal integration of acceleration sensor structuresINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Application pending·0 cites
- 3846US2009158999A1Manufacturing method for an integrated circuit comprising a multi-layer stack, corresponding integrated circuit and multi-layer maskQIMONDA AG·Filed 2007·Application pending·0 cites
- 3946US2008038462A1Method of forming a carbon layer on a substrateQIMONDA AG·Filed 2006·Application pending·0 cites
- 4045US2007243707A1Hard Mask Layer Stack And A Method Of PatterningQIMONDA AG·Filed 2007·Application pending·0 cites
- 4145US2009166318A1Method of Fabricating an Integrated CircuitSEITZ MIHEL·Filed 2007·Application pending·0 cites
- 4243US9452923B2Method for manufacturing a micromechanical system comprising a removal of sacrificial material through a hole in a margin regionINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2012·Granted Sep 27, 2016·0 cites·21 claims
- 4341US2015235864A1Method for processing a layer and a method for manufacturing an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 4439US10700221B2Microlens having a carrier-free optical interference filterINFINEON TECH DRESDEN GMBH & CO KG·Filed 2018·Granted Jun 30, 2020·0 cites·21 claims
- 4539US7220664B2Fabrication method for semiconductor structure in a substrate, the semiconductor structure having at least two regions that are to be patterned differentlyINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 22, 2007·0 cites·14 claims
- 4639US2007264819A1Method of forming an electrical isolation associated with a wiring level on a semiconductor waferOFFENBERG DIRK·Filed 2005·Application pending·0 cites
- 4739US2005009350A1Carbon hard mask with bonding layer for bonding to metalFiled 2004·Application pending·0 cites
- 4839US2007090531A1Method of forming an electrical isolation associated with a wiring level on a semiconductor waferOFFENBERG DIRK·Filed 2005·Application pending·0 cites
- 4938US7037777B2Process for producing an etching mask on a microstructure, in particular a semiconductor structure with trench capacitors, and corresponding use of the etching maskINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 2, 2006·0 cites·12 claims
- 5038US6861206B2Method for producing a structured layer on a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 1, 2005·0 cites·10 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →