Inventor · disambiguated record
Yoshio Morishige
Also filed as: MORISHIGE YOSHIO
22 granted patents·646 citations·filing 1996–2012
97Inventor score
Files withHITACHI LTD8HITACHI ELECTR ENG5HITACHI HIGH TECH CORP5HAMAMATSU AKIRA2HITACHI HIGH TECH ELECT ENG CO1
Top patents by PatentIndex Score
22 records- 0197US7098055B2Apparatus and method for testing defectsHITACHI HIGH TECH CORP·Filed 2005·Granted Aug 29, 2006·36 cites·7 claims
- 0296US7940383B2Method of detecting defects on an objectHITACHI LTD·Filed 2009·Granted May 10, 2011·42 cites·20 claims
- 0396US7639350B2Apparatus and method for testing defectsHITACHI LTD·Filed 2007·Granted Dec 29, 2009·25 cites·20 claims
- 0496US6411377B1Optical apparatus for defect and particle size inspectionHITACHI LTD·Filed 1999·Granted Jun 25, 2002·174 cites·29 claims
- 0594US7061602B2Method of inspecting a semiconductor device and an apparatus thereofHITACHI HIGH TECH CORP·Filed 2005·Granted Jun 13, 2006·18 cites·13 claims
- 0693US7443496B2Apparatus and method for testing defectsHITACHI LTD·Filed 2007·Granted Oct 28, 2008·16 cites·15 claims
- 0792US7037735B2Apparatus and method for testing defectsHITACHI HIGH TECH CORP·Filed 2002·Granted May 2, 2006·43 cites·18 claims
- 0891US7692779B2Apparatus and method for testing defectsHITACHI LTD·Filed 2005·Granted Apr 6, 2010·12 cites·20 claims
- 0991US7417723B2Method of inspecting a semiconductor device and an apparatus thereofHITACHI LTD·Filed 2006·Granted Aug 26, 2008·10 cites·12 claims
- 1090US6888959B2Method of inspecting a semiconductor device and an apparatus thereofHITACHI HIGH TECH ELECT ENG CO·Filed 2001·Granted May 3, 2005·38 cites·20 claims
- 1188US8422009B2Foreign matter inspection method and foreign matter inspection apparatusYAMASHITA HIROYUKI·Filed 2011·Granted Apr 16, 2013·6 cites·5 claims
- 1287US5694214ASurface inspection method and apparatusHITACHI ELECTR ENG·Filed 1996·Granted Dec 2, 1997·86 cites·9 claims
- 1386US8274651B2Method of inspecting a semiconductor device and an apparatus thereofHAMAMATSU AKIRA·Filed 2011·Granted Sep 25, 2012·3 cites·14 claims
- 1485US7643138B2Method of inspecting a semiconductor device and an apparatus thereofHITACHI LTD·Filed 2008·Granted Jan 5, 2010·5 cites·12 claims
- 1582US8040503B2Method of inspecting a semiconductor device and an apparatus thereofHITACHI LTD·Filed 2010·Granted Oct 18, 2011·2 cites·12 claims
- 1679US5644393AExtraneous substance inspection method and apparatusHITACHI ELECTR ENG·Filed 1996·Granted Jul 1, 1997·51 cites·10 claims
- 1774US7719671B2Foreign matter inspection method and foreign matter inspection apparatusHITACHI HIGH TECH CORP·Filed 2007·Granted May 18, 2010·3 cites·6 claims
- 1871US5880828ASurface defect inspection device and shading correction method thereforHITACHI ELECTR ENG·Filed 1997·Granted Mar 9, 1999·36 cites·10 claims
- 1970US5818576AExtraneous substance inspection apparatus for patterned waferHITACHI ELECTR ENG·Filed 1996·Granted Oct 6, 1998·36 cites·9 claims
- 2056US8559000B2Method of inspecting a semiconductor device and an apparatus thereofHAMAMATSU AKIRA·Filed 2012·Granted Oct 15, 2013·0 cites·16 claims
- 2155US7986405B2Foreign matter inspection method and foreign matter inspection apparatusHITACHI HIGH TECH CORP·Filed 2010·Granted Jul 26, 2011·0 cites·8 claims
- 2234US5724132AExtraneous substance inspection apparatus for patterned waferHITACHI ELECTR ENG·Filed 1996·Granted Mar 3, 1998·4 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →