Inventor · disambiguated record
Huong Nguyen
Also filed as: NGUYEN HUONG · NGUYEN HUONG T · NGUYEN HUONG THANH
18 granted patents·6 pending applications·1,270 citations·filing 1996–2007
96Inventor score
Top patents by PatentIndex Score
24 records- 0197US6939434B2Externally excited torroidal plasma source with magnetic control of ion distributionAPPLIED MATERIALS INC·Filed 2002·Granted Sep 6, 2005·72 cites·48 claims
- 0296US7244672B2Selective etching of organosilicate films over silicon oxide stop etch layersAPPLIED MATERIALS INC·Filed 2005·Granted Jul 17, 2007·36 cites·18 claims
- 0396US6569257B1Method for cleaning a process chamberAPPLIED MATERIALS INC·Filed 2000·Granted May 27, 2003·86 cites·67 claims
- 0496US6013155AGas injection system for plasma processingLAM RES CORP·Filed 1997·Granted Jan 11, 2000·294 cites·29 claims
- 0595US6258735B1Method for using bypass lines to stabilize gas flow and maintain plasma inside a deposition chamberAPPLIED MATERIALS INC·Filed 2000·Granted Jul 10, 2001·84 cites·23 claims
- 0694US6184158B1Inductively coupled plasma CVDLAM RES CORP·Filed 1996·Granted Feb 6, 2001·193 cites·60 claims
- 0794US5835334AVariable high temperature chuck for high density plasma chemical vapor depositionLAM RESEARCH·Filed 1996·Granted Nov 10, 1998·269 cites·51 claims
- 0889US6270862B1Method for high density plasma chemical vapor deposition of dielectric filmsLAM RES CORP·Filed 1999·Granted Aug 7, 2001·88 cites·25 claims
- 0988US6680164B2Solvent free photoresist strip and residue removal processing for post etching of low-k filmsAPPLIED MATERIALS INC·Filed 2001·Granted Jan 20, 2004·42 cites·44 claims
- 1084US6991739B2Method of photoresist removal in the presence of a dielectric layer having a low k-valueAPPLIED MATERIALS INC·Filed 2001·Granted Jan 31, 2006·34 cites·26 claims
- 1171US7550851B2Adhesion of tungsten nitride films to a silicon surfaceNOVELLUS SYSTEMS INC·Filed 2006·Granted Jun 23, 2009·4 cites·18 claims
- 1271US6521546B1Method of making a fluoro-organosilicate layerAPPLIED MATERIALS INC·Filed 2000·Granted Feb 18, 2003·14 cites·39 claims
- 1367US7160802B2Adhesion of tungsten nitride films to a silicon surfaceNOVELLUS SYSTEMS INC·Filed 2005·Granted Jan 9, 2007·3 cites·13 claims
- 1467US6626185B2Method of depositing a silicon containing layer on a semiconductor substrateLAM RES CORP·Filed 1999·Granted Sep 30, 2003·21 cites·17 claims
- 1565US6514850B2Interface with dielectric layer and method of makingAPPLIED MATERIALS INC·Filed 2001·Granted Feb 4, 2003·9 cites·29 claims
- 1660US7097716B2Method for performing fluorocarbon chamber cleaning to eliminate fluorine memory effectAPPLIED MATERIALS INC·Filed 2002·Granted Aug 29, 2006·15 cites·15 claims
- 1756US6511920B2Optical marker layer for etch endpoint determinationAPPLIED MATERIALS INC·Filed 2001·Granted Jan 28, 2003·5 cites·12 claims
- 1853US2008023443A1Alternating asymmetrical plasma generation in a process chamberPATERSON ALEXANDER·Filed 2007·Application pending·0 cites
- 1949US2005241762A1Alternating asymmetrical plasma generation in a process chamberAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 2048US7183201B2Selective etching of organosilicate films over silicon oxide stop etch layersAPPLIED MATERIALS INC·Filed 2001·Granted Feb 27, 2007·1 cites·24 claims
- 2140US2003194496A1Methods for depositing dielectric materialAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 2239US2005158667A1Solvent free photoresist strip and residue removal processing for post etching of low-k filmsAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 2338US2001019903A1Inductively coupled plasma CVDFiled 2001·Application pending·0 cites
- 2437US2003194510A1Methods used in fabricating gates in integrated circuit device structuresAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →