Inventor · disambiguated record
Jon Zuo
Also filed as: ZUO JON
16 granted patents·6 pending applications·928 citations·filing 2001–2019
96Inventor score
Files withTHERMAL CORP11ADVANCED COOLING TECH INC2ADVANCED COOLING TECHNOLOGIES1ANDERSON WILLIAM G1ZUO JON1
Top patents by PatentIndex Score
22 records- 0197US10638639B1Double sided heat exchanger cooling unitADVANCED COOLING TECH INC·Filed 2016·Granted Apr 28, 2020·16 cites·22 claims
- 0297US6536510B2Thermal bus for cabinets housing high power electronics equipmentTHERMAL CORP·Filed 2001·Granted Mar 25, 2003·173 cites·36 claims
- 0396US6889755B2Heat pipe having a wick structure containing phase change materialsTHERMAL CORP·Filed 2003·Granted May 10, 2005·113 cites·4 claims
- 0496US6631077B2Heat spreader with oscillating flowTHERMAL CORP·Filed 2002·Granted Oct 7, 2003·66 cites·21 claims
- 0594US6990816B1Hybrid capillary cooling apparatusADVANCED COOLING TECHNOLOGIES·Filed 2004·Granted Jan 31, 2006·87 cites·15 claims
- 0694US6408941B1Folded fin plate heat-exchangerTHERMAL CORP·Filed 2001·Granted Jun 25, 2002·50 cites·8 claims
- 0793US6948556B1Hybrid loop cooling of high powered devicesANDERSON WILLIAM G·Filed 2003·Granted Sep 27, 2005·105 cites·41 claims
- 0891US6525420B2Semiconductor package with lid heat spreaderTHERMAL CORP·Filed 2001·Granted Feb 25, 2003·54 cites·24 claims
- 0991US6437437B1Semiconductor package with internal heat spreaderTHERMAL CORP·Filed 2001·Granted Aug 20, 2002·49 cites·28 claims
- 1091US6388882B1Integrated thermal architecture for thermal management of high power electronicsTHERMAL CORP·Filed 2001·Granted May 14, 2002·134 cites·28 claims
- 1189US7306028B2Modular heat sinkTHERMAL CORP·Filed 2005·Granted Dec 11, 2007·17 cites·20 claims
- 1284US7005738B2Semiconductor package with lid heat spreaderTHERMAL CORP·Filed 2004·Granted Feb 28, 2006·28 cites·26 claims
- 1378US6858929B2Semiconductor package with lid heat spreaderTHERMAL CORP·Filed 2002·Granted Feb 22, 2005·20 cites·21 claims
- 1469US11184996B1Double sided heat exchanger cooling unitADVANCED COOLING TECH INC·Filed 2019·Granted Nov 23, 2021·0 cites·18 claims
- 1563US6566743B1Electronics package with specific areas having low coefficient of thermal expansionTHERMAL CORP·Filed 2002·Granted May 20, 2003·9 cites·9 claims
- 1659US6579747B1Method of making electronics package with specific areas having low coefficient of thermal expansionFiled 2002·Granted Jun 17, 2003·7 cites·2 claims
- 1741US2005269063A1Heat pipe having a wick structure containing phase change materialsZUO JON·Filed 2004·Application pending·0 cites
- 1839US2002139516A1Heat pipe with a secondary wick for supplying subcooled liquid to high heat flux areasFiled 2001·Application pending·0 cites
- 1938US2003030987A1Method and apparatus for pumped liquid coolingFiled 2002·Application pending·0 cites
- 2037US2003075306A1Thermal control layer in miniature LHP/CPL wicksFiled 2001·Application pending·0 cites
- 2136US2003030981A1Method and apparatus for pumped liquid coolingFiled 2001·Application pending·0 cites
- 2235US2002100288A1Metal hydride storage apparatusFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →