Heat pipe having a wick structure containing phase change materials

Abstract

A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak thermal loads.

1 . A wick for use in a heat pipe, including a plurality of particles wherein said particles comprise micro-encapsulated phase change materials.  
   
   
       2 . The wick of  claim 1  wherein said particles of micro encapsulated phase change material are of varying sizes.  
   
   
       3 . The wick of  claim 1  wherein said particles are adhered to one another.  
   
   
       4 . The wick of  claim 1  wherein said particles are sintered.  
   
   
       5 . A heat pipe comprising: 
 an envelope;    a wick including particles comprising micro-encapsulated phase change materials secured within said envelope; and    a working fluid disposed within said envelope.    
   
   
       6 . A heat transfer device comprising: 
 a heat pipe having an envelope, a working fluid and a wick comprising micro-encapsulated phase change particles bonded together to form said wick; and    a heat sink mounted to said heat pipe.    
   
   
       7 . The heat transfer device of  claim 6  wherein said heat sink includes particles of micro-encapsulated phase change material attached to an outside surface of said heat sink.  
   
   
       8 . The heat transfer device of  claim 6  wherein said heat sink includes particles of micro-encapsulated phase change material contained within said heat sink.  
   
   
       9 - 13 . (canceled)  
   
   
       14 . A heat transfer device comprising: 
 a heat pipe comprising an envelope, a wick secured within the envelope, and a working fluid; and    a heat sink adjacent to said heat pipe, said heat sink including particles of micro-encapsulated phase change material.    
   
   
       15 . The heat transfer device of  claim 14  wherein said particles of micro-encapsulated phase change material are attached to an outside surface of said heat sink.  
   
   
       16 . The heat transfer device of  claim 14  wherein said heat sink is hollow and further wherein said particles of micro-encapsulated phase change material are contained within said heat sink.  
   
   
       17 . A wick for use in a heat pipe formed from a plurality of micro-encapsulated phase change particles.  
   
   
       18 . The wick of  claim 17  wherein said particles of micro-encapsulated phase change particles are of varying sizes.  
   
   
       19 . The wick of  claim 17  wherein said particles are adhered to one another.  
   
   
       20 . The wick of  claim 17  wherein said particles are sintered.