Inventor · disambiguated record
Jinho Chun
Also filed as: CHUN JINHO
11 granted patents·5 pending applications·27 citations·filing 2010–2025
85Inventor score
Top patents by PatentIndex Score
16 records- 0193US11996358B2Semiconductor packages having first and second redistribution patternsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 28, 2024·2 cites·18 claims
- 0293US9530706B2Semiconductor devices having hybrid stacking structures and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 27, 2016·13 cites·17 claims
- 0391US9799619B2Electronic device having a redistribution areaSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 24, 2017·9 cites·20 claims
- 0489US11476176B2Semiconductor device having via protective layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 18, 2022·2 cites·19 claims
- 0583US2025336798A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0681US12368093B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 0781US11538783B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 27, 2022·1 cites·20 claims
- 0879US12354987B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 0973US11984420B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 1073US11978688B2Semiconductor device having via protective layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 1173US2025014958A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1259US2024347437A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1357US12142541B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 12, 2024·0 cites·20 claims
- 1448US11444014B2Semiconductor packages including an insulating layer including a recessed surface and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 13, 2022·0 cites·18 claims
- 1546US2017110445A1Semiconductor devices having hybrid stacking structures and methods of fabricating the sameKANG PIL-KYU·Filed 2016·Application pending·0 cites
- 1632US2010190333A1Method of forming connection terminalSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →