Inventor · disambiguated record
Ki Youn Jang
Also filed as: JANG KI YOUN
36 granted patents·1 pending application·430 citations·filing 2004–2019
97Inventor score
Top patents by PatentIndex Score
37 records- 0198US8304900B2Integrated circuit packaging system with stacked lead and method of manufacture thereofJANG KI YOUN·Filed 2010·Granted Nov 6, 2012·120 cites·20 claims
- 0298US7537962B2Method of fabricating a shielded stacked integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted May 26, 2009·78 cites·18 claims
- 0395US8471394B2Integrated circuit packaging system with package-on-package and method of manufacture thereofJANG KI YOUN·Filed 2011·Granted Jun 25, 2013·22 cites·9 claims
- 0494US8178392B2Electronic system with expansion featureCHOI HAENGCHEOL·Filed 2007·Granted May 15, 2012·45 cites·20 claims
- 0592US8035235B2Integrated circuit packaging system with package-on-package and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Oct 11, 2011·21 cites·17 claims
- 0686US9582051B2Mobile communication terminal having radiant-heat sheetSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 28, 2017·6 cites·8 claims
- 0786US7453156B2Wire bond interconnectionCHIPPAC INC·Filed 2005·Granted Nov 18, 2008·11 cites·22 claims
- 0885US10197457B2Heating control method and electronic device thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 5, 2019·6 cites·19 claims
- 0985US9202715B2Integrated circuit packaging system with connection structure and method of manufacture thereofKIM YOUNGCHUL·Filed 2011·Granted Dec 1, 2015·9 cites·10 claims
- 1085US7909233B2Method of manufacturing a semiconductor package with fine pitch lead fingersSTATS CHIPPAC LTD·Filed 2010·Granted Mar 22, 2011·7 cites·10 claims
- 1185US7485502B2Integrated circuit underfill package systemSTATS CHIPPAC LTD·Filed 2006·Granted Feb 3, 2009·13 cites·10 claims
- 1284US8018040B2Shielded stacked integrated circuit packaging system and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Sep 13, 2011·9 cites·16 claims
- 1382US7679177B2Integrated circuit packaging system with passive componentsSTATS CHIPPAC LTD·Filed 2007·Granted Mar 16, 2010·10 cites·20 claims
- 1479US7741726B2Integrated circuit underfill package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jun 22, 2010·8 cites·9 claims
- 1579US7731078B2Semiconductor system with fine pitch lead fingersSTATS CHIPPAC LTD·Filed 2005·Granted Jun 8, 2010·7 cites·10 claims
- 1677US10340737B2Electronic device and method for controlling fan of electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 2, 2019·2 cites·17 claims
- 1776US8129263B2Wire bond interconnection and method of manufacture thereofLEE HUN-TEAK·Filed 2011·Granted Mar 6, 2012·3 cites·16 claims
- 1876US7772683B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Aug 10, 2010·7 cites·17 claims
- 1974US7745322B2Wire bond interconnectionCHIPPAC INC·Filed 2008·Granted Jun 29, 2010·4 cites·8 claims
- 2072US10698461B2Electronic device and heat control method based on temperature of battery in electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 30, 2020·2 cites·19 claims
- 2172US10064318B2Shield can assembly and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 28, 2018·2 cites·23 claims
- 2272US9129826B2Epoxy bump for overhang dieLEE HUN TEAK·Filed 2006·Granted Sep 8, 2015·6 cites·17 claims
- 2372US7986047B2Wire bond interconnectionCHIPPAC INC·Filed 2010·Granted Jul 26, 2011·2 cites·9 claims
- 2471US8110908B2Integrated circuit packaging system using bottom flip chip die bonding and method of manufacture thereofKIM YOUNGJOON·Filed 2008·Granted Feb 7, 2012·5 cites·20 claims
- 2569US8772916B2Integrated circuit package system employing mold flash prevention technologyJANG KI YOUN·Filed 2012·Granted Jul 8, 2014·2 cites·5 claims
- 2667US8252615B2Integrated circuit package system employing mold flash prevention technologyJANG KI YOUN·Filed 2006·Granted Aug 28, 2012·3 cites·10 claims
- 2767US7407080B2Wire bond capillary tipCHIPPAC INC·Filed 2004·Granted Aug 5, 2008·14 cites·18 claims
- 2864US8524538B2Integrated circuit packaging system with film assistance mold and method of manufacture thereofLEE JAEHYUN·Filed 2011·Granted Sep 3, 2013·2 cites·20 claims
- 2964US8368200B2Shielded stacked integrated circuit packaging system and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2011·Granted Feb 5, 2013·1 cites·16 claims
- 3062US10470345B2Electronic device including shield structureSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 5, 2019·1 cites·19 claims
- 3161US8703541B2Electronic system with expansion featureCHOI HAENGCHEOL·Filed 2012·Granted Apr 22, 2014·1 cites·20 claims
- 3261US8513057B2Integrated circuit packaging system with routable underlayer and method of manufacture thereofKIM OH HAN·Filed 2011·Granted Aug 20, 2013·1 cites·20 claims
- 3358USRE48641EMobile communication terminal having radiant-heat sheetSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 13, 2021·0 cites·18 claims
- 3455US10842057B2Shield can assembly and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 17, 2020·0 cites·22 claims
- 3549US8256660B2Semiconductor package system with fine pitch lead fingers and method of manufacturing thereofLEE HUN TEAK·Filed 2011·Granted Sep 4, 2012·0 cites·21 claims
- 3645US8519517B2Semiconductor system with fine pitch lead fingers and method of manufacturing thereofLEE HUN TEAK·Filed 2011·Granted Aug 27, 2013·0 cites·10 claims
- 3740US2007001296A1Bump for overhang deviceSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ki Youn Jang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →