Inventor · disambiguated record
Steven Chen
Also filed as: CHEN STEVEN · CHEN STEVEN A · CHEN STEVEN AIHUA
20 granted patents·3 pending applications·2,374 citations·filing 1992–2003
97Inventor score
Files withAPPLIED MATERIALS INC15LEVITON MANUFACTURING CO1TAIWAN SEMICONDUCTOR MFG1UNITED MICROELECTRONICS CORP1
Top patents by PatentIndex Score
23 records- 0199US5796074AWafer heater assemblyAPPLIED MATERIALS INC·Filed 1995·Granted Aug 18, 1998·609 cites·21 claims
- 0298US6423949B1Multi-zone resistive heaterAPPLIED MATERIALS INC·Filed 1999·Granted Jul 23, 2002·534 cites·62 claims
- 0398US5837058AHigh temperature susceptorAPPLIED MATERIALS INC·Filed 1996·Granted Nov 17, 1998·551 cites·22 claims
- 0496US6066836AHigh temperature resistive heater for a process chamberAPPLIED MATERIALS INC·Filed 1996·Granted May 23, 2000·80 cites·38 claims
- 0594US5294374AElectrical overstress materials and method of manufactureLEVITON MANUFACTURING CO·Filed 1992·Granted Mar 15, 1994·195 cites·20 claims
- 0689US6646235B2Multi-zone resistive heaterAPPLIED MATERIALS INC·Filed 2001·Granted Nov 11, 2003·43 cites·4 claims
- 0788US6582522B2Emissivity-change-free pumping plate kit in a single wafer chamberAPPLIED MATERIALS INC·Filed 2001·Granted Jun 24, 2003·37 cites·13 claims
- 0887US6645884B1Method of forming a silicon nitride layer on a substrateAPPLIED MATERIALS INC·Filed 1999·Granted Nov 11, 2003·61 cites·26 claims
- 0986US6586343B1Method and apparatus for directing constituents through a processing chamberAPPLIED MATERIALS INC·Filed 1999·Granted Jul 1, 2003·90 cites·18 claims
- 1080US6559039B2Doped silicon deposition process in resistively heated single wafer chamberAPPLIED MATERIALS INC·Filed 2001·Granted May 6, 2003·23 cites·41 claims
- 1176US6559074B1Method of forming a silicon nitride layer on a substrateAPPLIED MATERIALS INC·Filed 2001·Granted May 6, 2003·19 cites·14 claims
- 1271US6726955B1Method of controlling the crystal structure of polycrystalline siliconAPPLIED MATERIALS INC·Filed 2000·Granted Apr 27, 2004·14 cites·28 claims
- 1371US6530992B1Method of forming a film in a chamber and positioning a substitute in a chamberAPPLIED MATERIALS INC·Filed 1999·Granted Mar 11, 2003·40 cites·6 claims
- 1468US6802906B2Emissivity-change-free pumping plate kit in a single wafer chamberAPPLIED MATERIALS INC·Filed 2002·Granted Oct 12, 2004·11 cites·24 claims
- 1567US6908499B2Cold trap for CVD furnaceTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 21, 2005·12 cites·14 claims
- 1666US6156079AWindow support member for a semiconductor processing systemFiled 1998·Granted Dec 5, 2000·31 cites·22 claims
- 1762US6566183B1Method of making a transistor, in particular spacers of the transistorFiled 2001·Granted May 20, 2003·9 cites·20 claims
- 1861US6991999B2Bi-layer silicon film and method of fabricationAPPLIED MATERIALS INC·Filed 2001·Granted Jan 31, 2006·11 cites·20 claims
- 1945US2002045362A1Method of forming a silicon nitride layer on a semiconductor waferFiled 2001·Application pending·0 cites
- 2038US2003207547A1Silicon deposition process in resistively heated single wafer chamberFiled 2003·Application pending·0 cites
- 2135US6110284AApparatus and a method for shielding light emanating from a light source heating a semicondutor processing chamberAPPLIED MATERIALS INC·Filed 1998·Granted Aug 29, 2000·4 cites·16 claims
- 2229US6479307B2Method of monitoring loss of silicon nitrideUNITED MICROELECTRONICS CORP·Filed 2001·Granted Nov 12, 2002·0 cites·10 claims
- 2327US2003192793A1Container for blank optical disksFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →