Inventor · disambiguated record
Ching-Feng Yang
Also filed as: YANG CHING-FENG
46 granted patents·8 pending applications·194 citations·filing 2003–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD47TAIWAN SEMICONDUCTOR MFG2ACBEL POLYTECH INC1NAT UNIV TSING HUA1PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC1
Top patents by PatentIndex Score
54 records- 0197US9412661B2Method for forming package-on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 9, 2016·50 cites·12 claims
- 0295US10468355B2EMI Shielding structure in InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·12 cites·20 claims
- 0394US9966321B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 8, 2018·8 cites·20 claims
- 0494US9543373B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 10, 2017·15 cites·20 claims
- 0593US11574857B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 7, 2023·3 cites·20 claims
- 0693US10312112B2Integrated fan-out package having multi-band antenna and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 4, 2019·8 cites·20 claims
- 0791US2025364272A1Semiconductor device and manufacturing method thereofPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2025·Application pending·0 cites
- 0890US10043761B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 7, 2018·5 cites·20 claims
- 0989US9659879B1Semiconductor device having a guard ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·7 cites·20 claims
- 1089US9497861B2Methods and apparatus for package with interposersTAIWAN SEMIDONDUCTOR MFG COMPANY LTD·Filed 2012·Granted Nov 15, 2016·10 cites·20 claims
- 1189US2025336852A1Polymer layers embedded with metal pads for heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1288US12322670B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 3, 2025·1 cites·20 claims
- 1388US10950556B2EMI shielding structure in InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·4 cites·20 claims
- 1486US9806045B2Interconnection structure including a metal post encapsulated by solder joint having a concave outer surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 31, 2017·6 cites·20 claims
- 1586US9082761B2Polymer layers embedded with metal pads for heat dissipationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 14, 2015·5 cites·20 claims
- 1685US11114357B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 7, 2021·2 cites·20 claims
- 1783US11018083B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·2 cites·20 claims
- 1883US2024379519A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1982US12131986B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 2082US10157900B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·3 cites·20 claims
- 2182US9543263B2Semiconductor packaging and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 10, 2017·4 cites·20 claims
- 2282US2024379382A1Manufacturing method of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2381US9559071B2Mechanisms for forming hybrid bonding structures with elongated bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·4 cites·18 claims
- 2480US10748831B2Semiconductor packages having thermal through vias (TTV)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 18, 2020·2 cites·20 claims
- 2578US12412852B2Polymer layers embedded with metal pads for heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 2678US11101238B2Surface mounting semiconductor componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·2 cites·20 claims
- 2778US6813166B1Synchronous rectifyier controlled by a current transformerACBEL POLYTECH INC·Filed 2003·Granted Nov 2, 2004·36 cites·6 claims
- 2877US10510681B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 2975US10522437B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·1 cites·20 claims
- 3074US11658105B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 3171US12046480B2Manufacturing method of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 23, 2024·0 cites·20 claims
- 3271US9953942B2Semiconductor packaging and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 24, 2018·1 cites·20 claims
- 3370US11894330B2Methods of manufacturing a semiconductor device including a joint adjacent to a postTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
- 3470US11373922B2Semiconductor packages having thermal through vias (TTV)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·20 claims
- 3569US10727082B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 28, 2020·1 cites·20 claims
- 3669US2022285241A1Method of forming semiconductor packages having thermal through vias (ttv)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3767US11211339B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·0 cites·20 claims
- 3865US11233019B2Manufacturing method of semicondcutor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·0 cites·20 claims
- 3964US9941240B2Semiconductor chip scale package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 10, 2018·1 cites·18 claims
- 4061US11398440B2Polymer layers embedded with metal pads for heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 26, 2022·0 cites·20 claims
- 4159US10867957B2Mechanisms for forming hybrid bonding structures with elongated bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
- 4259US10622222B2Integrated fan-out package having multi-band antenna and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 14, 2020·0 cites·20 claims
- 4359US10312209B2Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 4, 2019·0 cites·20 claims
- 4456US10971463B2Interconnection structure including a metal post encapsulated by a joint material having concave outer surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 6, 2021·0 cites·20 claims
- 4556US2024096848A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4655US10720399B2Semicondcutor package and manufacturing method of semicondcutor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 21, 2020·0 cites·20 claims
- 4755US10163846B2Mechanisms for forming hybrid bonding structures with elongated bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·20 claims
- 4854US10109605B2Polymer layers embedded with metal pads for heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 23, 2018·0 cites·20 claims
- 4952US9355924B2Integrated circuit underfill schemeTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 31, 2016·0 cites·14 claims
- 5049US10269588B2Integrated circuit underfill schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·0 cites·20 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →