Inventor · disambiguated record
Harry J. Geyer
Also filed as: GEYER HARRY · GEYER HARRY J
14 granted patents·2 pending applications·558 citations·filing 1972–2004
94Inventor score
Top patents by PatentIndex Score
16 records- 0197US4927505AMetallization scheme providing adhesion and barrier propertiesMOTOROLA INC·Filed 1989·Granted May 22, 1990·184 cites·17 claims
- 0290US4880708AMetallization scheme providing adhesion and barrier propertiesMOTOROLA INC·Filed 1988·Granted Nov 14, 1989·61 cites·12 claims
- 0387US5980706AElectrode semiconductor workpiece holderSEMITOOL INC·Filed 1996·Granted Nov 9, 1999·73 cites·21 claims
- 0487US5467253ASemiconductor chip package and method of formingMOTOROLA INC·Filed 1994·Granted Nov 14, 1995·109 cites·21 claims
- 0581US4003073AIntegrated circuit device employing metal frame means with preformed conductor meansMOTOROLA INC·Filed 1972·Granted Jan 11, 1977·30 cites·2 claims
- 0669US6001234AMethods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing bootSEMITOOL INC·Filed 1997·Granted Dec 14, 1999·30 cites·2 claims
- 0762US6274013B1Electrode semiconductor workpiece holderSEMITOOL INC·Filed 1999·Granted Aug 14, 2001·21 cites·10 claims
- 0848US6461494B1Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing bootSEMITOOL INC·Filed 1999·Granted Oct 8, 2002·11 cites·5 claims
- 0948US4943708AData device module having locking grooveMOTOROLA INC·Filed 1988·Granted Jul 24, 1990·14 cites·14 claims
- 1041US2004035707A1Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing bootFiled 2003·Application pending·0 cites
- 1140US6733649B2Electrochemical processing methodSEMITOOL INC·Filed 2001·Granted May 11, 2004·0 cites·9 claims
- 1237US2004178065A1Electrode semiconductor workpiece holder and processing methodsSEMITOOL INC·Filed 2004·Application pending·0 cites
- 1335US5240165AMethod and apparatus for controlled deformation bondingMOTOROLA INC·Filed 1992·Granted Aug 31, 1993·8 cites·13 claims
- 1434US4795077ABonding method and apparatusMOTOROLA INC·Filed 1988·Granted Jan 3, 1989·7 cites·13 claims
- 1533US6805778B1Contact assembly for supplying power to workpieces during electrochemical processingSEMITOOL INC·Filed 1999·Granted Oct 19, 2004·4 cites·3 claims
- 1629US5232144AApparatus for tape automated bondingMOTOROLA INC·Filed 1992·Granted Aug 3, 1993·6 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →