Inventor · disambiguated record
Shang Hoon Seo
Also filed as: SEO SHANG HOON
19 granted patents·12 pending applications·34 citations·filing 2006–2023
91Inventor score
Files withSAMSUNG ELECTRO MECH15SAMSUNG ELECTRONICS CO LTD12LEE RO WOON2C O SAMSUNG ELECTRO MECHANICS CO LTD1SEO SHANG HOON1
Top patents by PatentIndex Score
31 records- 0193US10128179B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Nov 13, 2018·8 cites·33 claims
- 0286US10347586B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 9, 2019·5 cites·24 claims
- 0384US10410961B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 10, 2019·4 cites·24 claims
- 0483US10985127B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 20, 2021·3 cites·15 claims
- 0581US12300594B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 13, 2025·0 cites·19 claims
- 0681US10522497B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 31, 2019·3 cites·26 claims
- 0780US10475748B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 12, 2019·3 cites·22 claims
- 0877US10461008B2Electronic component package having stress alleviation structureSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 29, 2019·3 cites·20 claims
- 0975US10446481B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 15, 2019·1 cites·20 claims
- 1074US10115648B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 30, 2018·2 cites·22 claims
- 1172US11626364B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 11, 2023·0 cites·18 claims
- 1272US10861784B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 8, 2020·0 cites·20 claims
- 1366US9859243B2Electronic component package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jan 2, 2018·1 cites·6 claims
- 1465US10679933B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 9, 2020·0 cites·23 claims
- 1563US8148796B2Solar cell and manufacturing method thereofLEE RO-WOON·Filed 2009·Granted Apr 3, 2012·1 cites·13 claims
- 1654US2024178122A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1753US9929117B2Electronic component package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Mar 27, 2018·0 cites·15 claims
- 1852US2023026972A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1949US2010103214A1Inkjet head aligning methodSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2048US9279861B2Apparatus for testing switching of power semiconductor moduleSAMSUNG ELECTRO MECH·Filed 2013·Granted Mar 8, 2016·0 cites·19 claims
- 2148US9164145B2Apparatus and method for testing semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 20, 2015·0 cites·15 claims
- 2248US2010053645A1Method for processing data and recording media recorded with program realizing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2347US2014170412A1Insulating composition, substrate including insulating layer using the same, and method for manufacturing the substrateSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2446US2010055605A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2545US8141977B2Inkjet head module and method of aligning inkjet head using the sameLEE RO-WOON·Filed 2009·Granted Mar 27, 2012·0 cites·7 claims
- 2645US2013115369A1Apparatus for forming circuit pattern on pcb and method for forming circuit pattern using the sameSEO SHANG HOON·Filed 2012·Application pending·0 cites
- 2743US2014140373A1Apparatus and method of testing semiconductor moduleC O SAMSUNG ELECTRO MECHANICS CO LTD·Filed 2013·Application pending·0 cites
- 2840US2019131253A1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 2940US2019198429A1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 3035US2007006983A1Method for producing fine circuit lines and conductive boardSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 3130US2017365567A1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →