Method for producing fine circuit lines and conductive board

Abstract

The present invention provides a method for forming a circuit line which may be formed simply and economically by alleviating spread of an ink and exhibit excellent electric conductivity by having even height of the formed ink. The present invention further provides a conductive board with excellent high-dense electric conductivity including fine circuit lines. According to one embodiment of the present invention, a method for forming fine circuit lines comprises (a) treating at least one side of a circuit line pattern to be formed on a base substrate with an alkali metal hydroxide solution and (b) treating a hydrophobic ink in accordance to a circuit line pattern to be formed.

1 . A method for forming fine circuit lines comprising: 
 (a) treating at least one side of a circuit line pattern to be formed on a base substrate with an alkali metal hydroxide solution; and    (b) treating with an hydrophobic ink along with the circuit line pattern to be formed.    
   
   
       2 . The method for forming fine circuit lines of  claim 1 , wherein both sides of the circuit line pattern to be formed are simultaneously treated in the step (a).  
   
   
       3 . The method for forming fine circuit lines of  claim 2 , wherein a step for treating the portion treated with the alkali metal hydroxide solution further with a weak acid solution prior to the step (b).  
   
   
       4 . The method for forming fine circuit lines of  claim 3 , wherein the weak acid is at least one selected from the group consisting of formic acid and C1-C20 alkanoic acids.  
   
   
       5 . The method for forming fine circuit lines of  claim 1 , wherein the alkali metal hydroxide solution is at least one selected from the group consisting of KOH, NaOH, and LiOH.  
   
   
       6 . The method for forming fine circuit lines of  claim 5 , wherein a concentration of the alkali metal hydroxide solution is in the range of from 0.1 to 10M.  
   
   
       7 . The method for forming fine circuit lines of  claim 1 , wherein the hydrophobic ink is an ink including tetradecane.  
   
   
       8 . The method for forming fine circuit lines of  claim 1 , wherein the base substrate is a polyimide film.  
   
   
       9 . The method for forming fine circuit lines of  claim 1 , wherein the alkali metal hydroxide solution or the hydrophobic ink is treated by an ink-jet method.  
   
   
       10 . A conductive board including circuit lines formed by a method for forming fine circuit lines comprising: 
 (a) treating at least one side of a circuit line pattern to be formed on a base substrate with an alkali metal hydroxide solution; and    (b) treating with an hydrophobic ink along with the circuit line pattern to be formed.    
   
   
       11 . The conductive board of  claim 10 , wherein the circuit lines have a width of 1 to 80 μm.